Vol. 30 No. 12(2)
Special Issue on Remote Sensing and Sensing Devices
Guest Editor: Haruichi Kanaya (Kyushu University)
Thin films of poly(3,4-ethylenedioxythiophene) (PEDOT) were fabricated via the vapor-phase polymerization (VPP) of the monomer 3,4-ethylenedioxythiophene (EDOT) with FeCl3·6H2O as the oxidant. ... Read More
The luminescence spectroscopy of the Al2O3 is widely used for sensing the stress in Al2O3-based materials. One promising approach that improves the spatial resolution of the luminescence spectros ... Read More
To replace Al–Ge eutectic bonding, low-temperature direct Cu-to-Cu bonding was developed in this study. Lattice distortion and thus a hardened Cu subsurface conducted by air plasma bombardment ... Read More
In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was perfo ... Read More
Fine cone-shaped bumps (6 µm) were fabricated by a nanoparticle deposition method, where the nanoparticles were deposited onto hole patterns defined in a photoresist. In this work, the goal is ... Read More
We describe microgravity generation and the resolution evaluation results of a sub-1-mG microelectromechanical system (MEMS) accelerometer (1 G = 9.8 m/s2). To realize input acceleration below 1 ... Read More
Remote sensing has been providing solutions in a variety of sectors as a result of the recent growth in technology and available data. Land cover mapping is the most widely used application of r ... Read More
In this paper, an antenna sensor for a radio-wave-type endoscope to detect a blood vessel in fatty tissue is proposed. The antenna sensor consists of one transmitting antenna and two receiving a ... Read More
With the recent spread of the Internet of Things (IoT), smart devices are equipped with a number of sensors to collect data necessary for various applications. A wake-up radio (WUR) is considere ... Read More
We present a highly efficient power amplifier (PA) with an impedance-matched planar antenna. An impedance-matching network including inductors and capacitors is a common and essential practice f ... Read More
S&M1724Research Paper of Special Issue |
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S&M1724 In situ Monitoring of Vapor-phase Polymerization and Characterization of Poly(3,4-ethylenedioxythiophene) Thin Films Yasuko Koshiba, Mana Hirai, Shohei Horike, Masahiro Morimoto, Masahiro Misaki, Tastuya Fukushima, and Kenji Ishida pp. 2873-2879 https://doi.org/10.18494/SAM.2018.1986 Published on December 18, 2018 PDF (open access) |
S&M1725Research Paper of Special Issue |
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S&M1725 Asymmetric Line Shape of Near-field Luminescence Spectrum Induced by Stress in Al2O3 Toru Tomimatsu and Ryo Takigawa pp. 2881-2888 https://doi.org/10.18494/SAM.2018.2019 Published on December 18, 2018 PDF (open access) |
S&M1726Research Paper of Special Issue |
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S&M1726 Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging Jenn-Ming Song, Sin-Yong Liang, Zong-Yu Xie, Po-Hao Chiang, Shang-Kun Huang, Ying-Ta Chiu, David Tarng, Chih-Pin Hung, and Jing-Yuan Lin pp. 2889-2895 https://doi.org/10.18494/SAM.2018.1948 Published on December 18, 2018 PDF (open access) |
S&M1727Research Paper of Special Issue |
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S&M1727 Room-temperature Hermetic Packaging Using Ultrasonic Cu–Cu Bonding with Compliant Rim Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, and Tanemasa Asano pp. 2897-2903 https://doi.org/10.18494/SAM.2018.1967 Published on December 18, 2018 PDF (open access) |
S&M1728Research Paper of Special Issue |
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S&M1728 Fine Cone-shaped Bumps for Three-dimensional LSI Package—An Optimization of Thermocompression Bonding Process Shunsuke Nemoto, Ying Ying Lim, Hiroshi Nakagawa, Katsuya Kikuchi, and Masahiro Aoyagi pp. 2905-2917 https://doi.org/10.18494/SAM.2018.2009 Published on December 18, 2018 PDF (open access) |
S&M1729Research Paper of Special Issue |
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S&M1729 Microgravity Generation Using Tilting Board for Resolution Evaluation of MEMS Accelerometer Motohiro Takayasu, Ippei Tsuji, Hiroyuki Ito, Daisuke Yamane, Shiro Dosho, Toshifumi Konishi, Noboru Ishihara, Katsuyuki Machida, and Kazuya Masu pp. 2919-2926 https://doi.org/10.18494/SAM.2018.1840 Published on December 18, 2018 PDF (open access) |
S&M1730Research Paper of Special Issue |
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S&M1730 Exploring Land Cover Classification Accuracy of Landsat 8 Image Using Spectral Index Layer Stacking in Hilly Region of South Korea Jae Kang Lee, Tri Dev Acharya, and Dong Ha Lee pp. 2927-2941 https://doi.org/10.18494/SAM.2018.1934 Published on December 18, 2018 PDF (open access) |
S&M1731Research Paper of Special Issue |
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S&M1731 Antenna Sensor for Radio-wave-type Endoscope Takafumi Fujimoto, Keiya Kawashima, Genki Horiguchi, and Toshiyuki Tanaka pp. 2943-2959 https://doi.org/10.18494/SAM.2018.1965 Published on December 18, 2018 PDF (open access) |
S&M1732Research Paper of Special Issue |
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S&M1732 Wake-up Radio-resilient Scanning Mechanism for Mobile Device in IEEE 802.11ba Hyunhee Park and Eui-Jik Kim pp. 2961-2968 https://doi.org/10.18494/SAM.2018.1961 Published on December 18, 2018 PDF (open access) |
S&M1733Research Paper of Special Issue |
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S&M1733 Impedance-matched Planar-antenna-integrated High-efficiency Push-pull Power Amplifier with Center-tapped Transformer for 5 GHz Wireless Communication Takeshi Kuboki, Tomoki Sadakiyo, Wee Sang Park, and Haruichi Kanaya pp. 2969-2978 https://doi.org/10.18494/SAM.2018.2025 Published on December 18, 2018 PDF (open access) |
