ISSN 0914-4935

Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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 MYU K.K.
 Sensors and Materials
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Vol. 30 No. 12(2)
Special Issue on Remote Sensing and Sensing Devices

Guest Editor: Haruichi Kanaya (Kyushu University)

Preface

  • Thin films of poly(3,4-ethylenedioxythiophene) (PEDOT) were fabricated via the vapor-phase polymerization (VPP) of the monomer 3,4-ethylenedioxythiophene (EDOT) with FeCl3·6H2O as the oxidant. ... Read More

  • The luminescence spectroscopy of the Al2O3 is widely used for sensing the stress in Al2O3-based materials. One promising approach that improves the spatial resolution of the luminescence spectros ... Read More

  • To replace Al–Ge eutectic bonding, low-temperature direct Cu-to-Cu bonding was developed in this study. Lattice distortion and thus a hardened Cu subsurface conducted by air plasma bombardment ... Read More

  • In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was perfo ... Read More

  • Fine cone-shaped bumps (6 µm) were fabricated by a nanoparticle deposition method, where the nanoparticles were deposited onto hole patterns defined in a photoresist. In this work, the goal is ... Read More

  • We describe microgravity generation and the resolution evaluation results of a sub-1-mG microelectromechanical system (MEMS) accelerometer (1 G = 9.8 m/s2). To realize input acceleration below 1 ... Read More

  • Remote sensing has been providing solutions in a variety of sectors as a result of the recent growth in technology and available data. Land cover mapping is the most widely used application of r ... Read More

  • In this paper, an antenna sensor for a radio-wave-type endoscope to detect a blood vessel in fatty tissue is proposed. The antenna sensor consists of one transmitting antenna and two receiving a ... Read More

  • With the recent spread of the Internet of Things (IoT), smart devices are equipped with a number of sensors to collect data necessary for various applications. A wake-up radio (WUR) is considere ... Read More

  • We present a highly efficient power amplifier (PA) with an impedance-matched planar antenna. An impedance-matching network including inductors and capacitors is a common and essential practice f ... Read More


S&M1724

Research Paper of Special Issue

S&M1724
In situ Monitoring of Vapor-phase Polymerization and Characterization of Poly(3,4-ethylenedioxythiophene) Thin Films
Yasuko Koshiba, Mana Hirai, Shohei Horike, Masahiro Morimoto, Masahiro Misaki, Tastuya Fukushima, and Kenji Ishida
pp. 2873-2879
https://doi.org/10.18494/SAM.2018.1986
Published on December 18, 2018
PDF (open access)

S&M1725

Research Paper of Special Issue

S&M1725
Asymmetric Line Shape of Near-field Luminescence Spectrum Induced by Stress in Al2O3
Toru Tomimatsu and Ryo Takigawa
pp. 2881-2888
https://doi.org/10.18494/SAM.2018.2019
Published on December 18, 2018
PDF (open access)

S&M1726

Research Paper of Special Issue

S&M1726
Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging
Jenn-Ming Song, Sin-Yong Liang, Zong-Yu Xie, Po-Hao Chiang, Shang-Kun Huang, Ying-Ta Chiu, David Tarng, Chih-Pin Hung, and Jing-Yuan Lin
pp. 2889-2895
https://doi.org/10.18494/SAM.2018.1948
Published on December 18, 2018
PDF (open access)

S&M1727

Research Paper of Special Issue

S&M1727
Room-temperature Hermetic Packaging Using Ultrasonic Cu–Cu Bonding with Compliant Rim
Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, and Tanemasa Asano
pp. 2897-2903
https://doi.org/10.18494/SAM.2018.1967
Published on December 18, 2018
PDF (open access)

S&M1728

Research Paper of Special Issue

S&M1728
Fine Cone-shaped Bumps for Three-dimensional LSI Package—An Optimization of Thermocompression Bonding Process
Shunsuke Nemoto, Ying Ying Lim, Hiroshi Nakagawa, Katsuya Kikuchi, and Masahiro Aoyagi
pp. 2905-2917
https://doi.org/10.18494/SAM.2018.2009
Published on December 18, 2018
PDF (open access)

S&M1729

Research Paper of Special Issue

S&M1729
Microgravity Generation Using Tilting Board for Resolution Evaluation of MEMS Accelerometer
Motohiro Takayasu, Ippei Tsuji, Hiroyuki Ito, Daisuke Yamane, Shiro Dosho, Toshifumi Konishi, Noboru Ishihara, Katsuyuki Machida, and Kazuya Masu
pp. 2919-2926
https://doi.org/10.18494/SAM.2018.1840
Published on December 18, 2018
PDF (open access)

S&M1730

Research Paper of Special Issue

S&M1730
Exploring Land Cover Classification Accuracy of Landsat 8 Image Using Spectral Index Layer Stacking in Hilly Region of South Korea
Jae Kang Lee, Tri Dev Acharya, and Dong Ha Lee
pp. 2927-2941
https://doi.org/10.18494/SAM.2018.1934
Published on December 18, 2018
PDF (open access)

S&M1731

Research Paper of Special Issue

S&M1731
Antenna Sensor for Radio-wave-type Endoscope
Takafumi Fujimoto, Keiya Kawashima, Genki Horiguchi, and Toshiyuki Tanaka
pp. 2943-2959
https://doi.org/10.18494/SAM.2018.1965
Published on December 18, 2018
PDF (open access)

S&M1732

Research Paper of Special Issue

S&M1732
Wake-up Radio-resilient Scanning Mechanism for Mobile Device in IEEE 802.11ba
Hyunhee Park and Eui-Jik Kim
pp. 2961-2968
https://doi.org/10.18494/SAM.2018.1961
Published on December 18, 2018
PDF (open access)

S&M1733

Research Paper of Special Issue

S&M1733
Impedance-matched Planar-antenna-integrated High-efficiency Push-pull Power Amplifier with Center-tapped Transformer for 5 GHz Wireless Communication
Takeshi Kuboki, Tomoki Sadakiyo, Wee Sang Park, and Haruichi Kanaya
pp. 2969-2978
https://doi.org/10.18494/SAM.2018.2025
Published on December 18, 2018
PDF (open access)

Cover of this Issue



Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on International Conference on BioSensors, BioElectronics, BioMedical Devices, BioMEMS/NEMS and Applications 2017 (Bio4Apps 2017)
Guest editor, Toshihiro Itoh (The University of Tokyo); Submission deadline, May 15, 2018
Conference website


Special Issue on Micro/Nano Sensing Platforms Exploring Biomedical Innovation
Guest editor, Ryoji Kurita (National Institute of Advanced Industrial Science and Technology)


Special Issue on Materials, Devices, Circuits, Analytical Methods for Various Sensors (Selected Papers from ICSEVEN 2018) (1)
Guest editor, Chien-Jung Huang (National University of Kaohsiung), Chi-Chih Liao (II-V Epiworks, Inc.), and Ja-Hao Chen (Feng Chia University)
Conference website
Call for paper


Special Issue on Selected Papers from ICASI2018
Guest editor, Teen-Hang Meen (National Formosa University), Shoou-Jinn Chang National Cheng Kung University), and Stephen D. Prior (University of Southampton)
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Special Issue on Mechanical and Thermal Reliability of Micro/Nanomaterials
Guest editor, Takahiro Namazu (Aichi Institute of Technology) and Shugo Miyake (Kobe City College of Technology)


Special Issue on the Workshop on Sensors and Applications for Fishery and Agricultural Industries
Guest editor, Masaaki Wada (Future University Hakodate) and Katsumori Hatanaka (Tokyo University of Agriculture); Submission deadline, October 12, 2018
Call for paper


Special Issue on Carbon Material-based Chemical and Biochemical Sensors
Guest editor, Yuko Ueno (NTT Basic Research Laboratories) and Osamu Niwa (Saitama Institute of Technology)
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Special Issue on Universal Power Supply Technologies for Trillion Sensors Era
Guest editor, Keiji Takeuchi (NTT Data Institute of Management Consulting, Inc.)
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Special Issue on the International Multi-Conference on Engineering and Technology Innovation 2018 (IMETI2018)
Guest editor, Wen-Hsiang Hsieh (National Formosa University)
Conference website


Special Issue on Advanced Nanofabrication Processes for Emerging Devices and Materials
Guest editor, Hiroyuki Akinaga (National Institute of Advanced Industrial Science and Technology, AIST)
Call for paper


Special Issue on Sensing, Interaction, and Fusion towards Smart Cities
Guest editor, Xuefeng Li (Tongji University)
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Special Issue on Magnetic Sensors and Applications
Guest editor, Keiji Tsukada (Okayama University)
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Special Issue on Smart Connections and Intelligent Computation in IoT
Guest editor, Jia-Shing Sheu (National Taipei University of Education)
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Special Issue on Sensors and Materials in Manufacturing
Guest editor, Ming Yan (Tokyo Metropolitan University) and Masao Murakawa (Nippon Institute of Technology)
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Special Issue on Food-Sensing Technologies and Applications
Guest editor, Hiroyuki Nakamoto (Kobe University)
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Special Issue on Smart Sensing Technology and Materials for Smart Industry and Environmental Applications
Guest editor, Somyot Kaitwanidvilai (King Mongkut’s Institute of Technology Ladkrabang)
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Special Issue on Environmental Sensing
Guest editor, Hiroshi Aoki (National Institute of Advanced Industrial Science and Technology, AIST)
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Special Issue on Remote Sensing and Geospatial Technologies for Sustainable Development
Guest editor, Dong Ha Lee and Tri Dev Acharya (Kangwon National University)
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Special Issue on Selected Papers from ICKII2019
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
Conference website
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Special Issue on Advanced Micro and Nanomaterials for various Sensor Applications (Selected Papers from ICASI 2019)
Guest editor, Sheng-Joue Young (National Formosa University), Shoou-Jinn Chang (National Cheng Kung University), Liang-Wen Ji (National Formosa University), and Yu-Jen Hsiao (Southern Taiwan University of Science and Technology)
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