ISSN 0914-4935
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
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Sensors and Materials, Volume 30, Number 4(1) (2018)
Copyright(C) MYU K.K. All Rights Reserved.
pp. 683-691
S&M1530 30th Commemorative Article
https://doi.org/10.18494/SAM.2018.1638
Published: April 13, 2018

Wafer-level Packaging, Equipment Made in House, and Heterogeneous Integration [PDF]

Masayoshi Esashi

(Received May 18, 2017; Accepted June 15, 2017)

Keywords: wafer-level packaging, heterogeneous integration, ion-sensitive FET, deep RIE, massive parallel electron beam write system

Micro-electromechanical systems (MEMS) has been developed for sensors and other systems since 1971 at Tohoku University. Ion-sensitive FET (ISFET) probes made by micromachining were commercialized for pH and PCO2 catheters. Special attention was paid to packaging and wafer-level packaging based on glass-to-Si anodic bonding was applied for integrated capacitive pressure sensors, capacitive diaphragm vacuum gauges, MEMS switches, and other devices. Process equipment for not only MEMS but also integrated circuits (ICs) has been made in house because it is important for flexible prototyping and fabrication of novel devices. Equipment for deep reactive ion etching (RIE) of Si was developed and applied for an electrostatically levitated rotational gyroscope and other devices. Heterogeneous integration as MEMS on LSI has been made possible by the transfer of MEMS on a carrier wafer to an LSI wafer or by stacking a MEMS wafer on an LSI wafer using electrical interconnection with a through Si via (TSV). A piezoelectric MEMS switch on an LSI chip, surface acoustic wave (SAW) filters on an LSI chip, a tactile sensor network, and an active matrix electron emitter array are shown as examples of these technologies.

Corresponding author: Masayoshi Esashi


Cite this article
Masayoshi Esashi, Wafer-level Packaging, Equipment Made in House, and Heterogeneous Integration, Sens. Mater., Vol. 30, No. 4, 2018, p. 683-691.



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