S&M Young Researcher Paper Award 2020
Recipients: Ding Jiao, Zao Ni, Jiachou Wang, and Xinxin Li [Winner's comments]
Paper: High Fill Factor Array of Piezoelectric Micromachined
Ultrasonic Transducers with Large Quality Factor

S&M Young Researcher Paper Award 2021
Award Criteria
Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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S&M2691 Research Paper of Special Issue

Parameter Matching for 3D Images by a Real 3D Display System with Sensors

Chong Zeng, Yue Wu, Jiali Chen, Tao Zan, Hsien-Wei Tseng, and Chun-Chi Chen

(Received March 26, 2021; Accepted September 2, 2021)

Keywords: real 3D display, high-speed, holographic, DMD, DLP, CMOS sensor

In this paper, we describe several key problems in the design of a real 3D display system with sensors (RDSS) and details of matching the parameters to generate 3D images. We also illustrate the feasibility of using light fields to reconstruct 3D images. Additionally, we propose a real 3D display based on optical field reconstruction that also solves the problems of fuzzy images and low mechanical stability caused by the scattering characteristics in an optical field display. We acquire images through sensors, and project them to a high-speed rotating mirror through digital light processing (DLP) after computer processing. At the same time, DLP is used to project images to the horizontal space, so that they can be observed by human eyes without auxiliary equipment. We find the best parameters for achieving a clear and stable image by comparing different experimental data. The matching parameters provided in this study can greatly reduce the cost of real 3D display systems that are easily usable and realizable and can be widely used in advertising, exhibitions, and other applications.

Corresponding author: Hsien-Wei Tseng, Chun-Chi Chen




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