Young Researcher Paper Award 2023
🥇Winners

Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Instructions to authors
English    日本語

Instructions for manuscript preparation
English    日本語

Template
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3827-8549
 Fax: 81-3-3827-8547

MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials, Volume 31, Number 10(2) (2019)
Copyright(C) MYU K.K.
pp. 3141-3153
S&M2000 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2019.2362
Published: October 25, 2019

Prediction of Flash Formed in Plastic Injection Molding Using Aluminum Alloy Mold Cavity by Numerical Simulation Considering Deformation of Mold Parts [PDF]

Makoto Nikawa, Hiroki Shibata, Keisuke Hatanaka, and Minoru Yamashita

(Received March 7, 2019; Accepted July 4, 2019)

Keywords: injection molding, computer simulation, mold deformation, flash, aluminum alloy mold

In this study, we examined a method of predicting the flash formed in plastic injection molding via computer simulations. The gap between molds was calculated by mold deformation simulation, and the results were compared with the actual flash thickness. The molding test was performed using a mold manufactured from steel and aluminum alloy. The pressure and temperature on the cavity surface during molding were measured using a measurement sensor. An injection molding simulation based on the actual pressure and temperature was carried out, and the results were mapped to the elements of a finite element (FE) model for mold deformation analysis. In this model, a mold equipped with a molding machine was used for the mold deformation analysis. The results of the mold deformation analysis were in good agreement with the actual results. The flash thickness with the product molded with an aluminum alloy mold was smaller than that with a steel mold. The calculated gap amount and the position of its generation correlated with the actual formed flash. The possibility of the present method for predicting flash formation was demonstrated.

Corresponding author: Makoto Nikawa


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.

Cite this article
Makoto Nikawa, Hiroki Shibata, Keisuke Hatanaka, and Minoru Yamashita, Prediction of Flash Formed in Plastic Injection Molding Using Aluminum Alloy Mold Cavity by Numerical Simulation Considering Deformation of Mold Parts, Sens. Mater., Vol. 31, No. 10, 2019, p. 3141-3153.



Forthcoming Regular Issues


Forthcoming Special Issues

Applications of Novel Sensors and Related Technologies for Internet of Things
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
Call for paper


Special Issue on Advanced Data Sensing and Processing Technologies for Smart Community and Smart Life
Guest editor, Tatsuya Yamazaki (Niigata University)
Call for paper


Special Issue on Advanced Sensing Technologies and Their Applications in Human/Animal Activity Recognition and Behavior Understanding
Guest editor, Kaori Fujinami (Tokyo University of Agriculture and Technology)
Call for paper


Special Issue on International Conference on Biosensors, Bioelectronics, Biomedical Devices, BioMEMS/NEMS and Applications 2023 (Bio4Apps 2023)
Guest editor, Dzung Viet Dao (Griffith University) and Cong Thanh Nguyen (Griffith University)
Conference website
Call for paper


Special Issue on Piezoelectric Thin Films and Piezoelectric MEMS
Guest editor, Isaku Kanno (Kobe University)
Call for paper


Special Issue on Advanced Micro/Nanomaterials for Various Sensor Applications (Selected Papers from ICASI 2023)
Guest editor, Sheng-Joue Young (National United University)
Conference website
Call for paper


Copyright(C) MYU K.K. All Rights Reserved.