ISSN 0914-4935
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Instructions to authors
English    日本語

Instructions for manuscript preparation
English    日本語

Template
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3827-8549
 Fax: 81-3-3827-8547

MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials, Volume 31, Number 3(1) (2019)
Copyright(C) MYU K.K. All Rights Reserved.
pp. 713-727
S&M1808
https://doi.org/10.18494/SAM.2019.2064
Published: March 8, 2019

Young’s Modulus Measurement of Submicron-thick Aluminum Films Using Fan-shaped Silicon Resonators [PDF]

Takahiro Namazu, Junki Kuroishi, Hiroya Yamagiwa, Daisuke Goto, Tatsuya Takeuchi, Kohei Murakami, Yasushi Kawashimo, and Tetsuo Takano

(Received July 22, 2018; Accepted November 1, 2018)

Keywords: submicron-thick Al films, vacuum evaporation, MEMS resonator, resonant frequency, Young’s modulus, material property measurement

In this paper, we describe a way of finding the optimum resonator geometry required to determine a reasonably accurate Young’s modulus of submicron-thick Al films. The films with thicknesses ranging from 15 to 380 nm are deposited onto the back of specially designed fan-shaped resonators by vacuum evaporation. Young’s modulus is calculated from the difference in resonant frequencies obtained before and after the deposition. By using resonators with the support beam length larger than 75 µm and cross-sectional aspect ratio larger than 1.0, the measured Young’s moduli of the Al films are close to the bulk value. When the films were thicker than 50 nm, the moduli show no film thickness effect (57.5 ± 5.8 GPa on average). Young’s moduli measured by resonance testing are compared with those measured by nanoindentation testing. The reliability of the measured Young’s moduli is discussed in light of resonant frequency and film thickness measurement cancellations of significant digits.

Corresponding author: Takahiro Namazu


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.

Cite this article
Takahiro Namazu, Junki Kuroishi, Hiroya Yamagiwa, Daisuke Goto, Tatsuya Takeuchi, Kohei Murakami, Yasushi Kawashimo, and Tetsuo Takano, Young’s Modulus Measurement of Submicron-thick Aluminum Films Using Fan-shaped Silicon Resonators, Sens. Mater., Vol. 31, No. 3, 2019, p. 713-727.



Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on the Workshop on Sensors and Applications for Fishery and Agricultural Industries
Guest editor, Masaaki Wada (Future University Hakodate) and Katsumori Hatanaka (Tokyo University of Agriculture)


Special Issue on Selected Papers from ICASI2018 (3)
Guest editor, Teen-Hang Meen (National Formosa University), Shoou-Jinn Chang National Cheng Kung University), and Stephen D. Prior (University of Southampton)
Conference website


Special Issue on Carbon Material-based Chemical and Biochemical Sensors
Guest editor, Yuko Ueno (NTT Basic Research Laboratories) and Osamu Niwa (Saitama Institute of Technology)


Special Issue on Materials, Devices, Circuits, Analytical Methods for Various Sensors (Selected Papers from ICSEVEN 2018) (2)
Guest editor, Chien-Jung Huang (National University of Kaohsiung), Chi-Chih Liao (II-V Epiworks, Inc.), and Ja-Hao Chen (Feng Chia University)
Conference website


5th Special Issue on the Workshop of Next-generation Front-edge Optical Science Research
Guest editor, Hidehito Nanto (Kanazawa Institute of Technology) and Takayuki Yanagida (Nara Institute of Science and Technology)


Special Issue on Universal Power Supply Technologies for Trillion Sensors Era
Guest editor, Keiji Takeuchi (NTT Data Institute of Management Consulting, Inc.)
Call for paper


Special Issue on the International Multi-Conference on Engineering and Technology Innovation 2018 (IMETI2018)
Guest editor, Wen-Hsiang Hsieh (National Formosa University)
Conference website


Special Issue on Advanced Nanofabrication Processes for Emerging Devices and Materials
Guest editor, Hiroyuki Akinaga (National Institute of Advanced Industrial Science and Technology, AIST)
Call for paper


Special Issue on Sensing, Interaction, and Fusion towards Smart Cities
Guest editor, Xuefeng Li (Tongji University)
Call for paper


Special Issue on Magnetic Sensors and Applications
Guest editor, Keiji Tsukada (Okayama University)
Call for paper


Special Issue on Smart Connections and Intelligent Computation in IoT
Guest editor, Jia-Shing Sheu (National Taipei University of Education)
Call for paper


Special Issue on Sensors and Materials in Manufacturing
Guest editor, Ming Yan (Tokyo Metropolitan University) and Masao Murakawa (Nippon Institute of Technology)
Call for paper


Special Issue on Food-Sensing Technologies and Applications
Guest editor, Hiroyuki Nakamoto (Kobe University)
Call for paper


Special Issue on CMOS-driven Biomedical Innovations
Guest editor, Kiichi Niitsu (Nagoya University)
Call for paper


Special Issue on New Trend of Robotics and Applications
Guest editor, Ikuo Yamamoto (Nagasaki University)
Call for paper


Special Issue on Smart Sensing Technology and Materials for Smart Industry and Environmental Applications
Guest editor, Somyot Kaitwanidvilai (King Mongkut’s Institute of Technology Ladkrabang)
Call for paper


Special Issue on Environmental Sensing
Guest editor, Hiroshi Aoki (National Institute of Advanced Industrial Science and Technology, AIST)
Call for paper


Special Issue on Sensor Fusion and Environment Perception for Autonomous Systems
Guest editor, Chenguang Yang (University of the West of England, Bristol)
Call for paper


Special Issue on Remote Sensing and Geospatial Technologies for Sustainable Development
Guest editor, Dong Ha Lee and Tri Dev Acharya (Kangwon National University)
Call for paper


Special Issue on International Conference on BioSensors, BioElectronics, BioMedical Devices, BioMEMS/NEMS and Applications 2017 (Bio4Apps 2017)
Guest editor, Xiaojun Han (Harbin Institute of Technology)
Conference website


Special Issue on Selected Papers from ICKII2019
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
Conference website
Call for paper


Special Issue on Advanced Micro and Nanomaterials for various Sensor Applications (Selected Papers from ICASI 2019)
Guest editor, Sheng-Joue Young (National Formosa University), Shoou-Jinn Chang (National Cheng Kung University), Liang-Wen Ji (National Formosa University), and Yu-Jen Hsiao (Southern Taiwan University of Science and Technology)
Conference website
Call for paper


Special Issue on Innovation in Smart Sensing Control, Metrology, Optimization and Intelligent Automation
Guest editor, Cheng-Chi Wang (National Chin-Yi University of Technology)
Conference website
Call for paper


Special Issue on Materials, Devices, Circuits, Analytical Methods for Various Sensors (Selected Papers from ICSEVEN 2019)
Guest editor, Chien-Jung Huang (National University of Kaohsiung), Cheng-Hsing Hsu (National United University), Ja-Hao Chen (Feng Chia University), and Wei-Ling Hsu (Huaiyin Normal University)
Conference website
Call for paper


Special Issue on Biological Odor Sensing System and Their Applications
Guest editor, Takeshi Sakurai (Tokyo University of Agriculture)
Call for paper


Special Issue on Software, Algorithms, and Applications Using Sensors and Networks
Guest editor, Yoshito Tobe (Aoyama Gakuin University)
Call for paper


Special Issue on Novel Sensing Technologies for Point of Care, Home Care, and Personal Health Care
Guest editor, Yu-Lin Wang (National Tsing Hua University)
Call for paper



Copyright(C) MYU K.K. All Rights Reserved.