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Sensors and Materials
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Sensors and Materials, Volume 31, Number 7(1) (2019)
Copyright(C) MYU K.K.
pp. 2183-2193
S&M1923 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2019.2055
Published: July 9, 2019

Real-time Thermographic Methodology with High-accuracy Temperature Monitoring Applied to Stacked Package of High-power Semiconductor Laser Diode [PDF]

Shun-Lung Yen, Shiang-Feng Tang, Chung-Wei Ou, Chin-Jung Chao, Hsin-Yen Cheng, Ing-Jiunn Su, and Tzu-Chiang Chen

(Received July 10, 2018; Accepted March 7, 2019)

Keywords: high-power semiconductor laser diode (HPSLD), regression coefficients, uncooled thermal camera, focal plane array (FPA), readout integrated circuit (ROIC), microchannel cooling (MCC)

To improve the accuracy of temperature measurement using a commercial thermal imager, the proposed correction methodology for the regression coefficients R, B, F, and O is applied, and the accuracy reaches <±1 °C in the temperature measurement range between 15 and 100 °C. The use of digital images with a Giga-Ethernet output interface for the development of temperature measurement and analysis software is the strategy of real-time temperature measurement and fast monitoring of the temperature of the target area. It will become a cost- effective room-temperature thermal imager with high accuracy of temperature measurement suitable for microzone application. The use of a thermal camera for the temperature observation of a microzone on a high-power striped laser diode (LD) is advantageous in the evaluation of the heat dissipation of a submount stage to improve the output efficiency of the laser.

Corresponding author: Shiang-Feng Tang


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Cite this article
Shun-Lung Yen, Shiang-Feng Tang, Chung-Wei Ou, Chin-Jung Chao, Hsin-Yen Cheng, Ing-Jiunn Su, and Tzu-Chiang Chen, Real-time Thermographic Methodology with High-accuracy Temperature Monitoring Applied to Stacked Package of High-power Semiconductor Laser Diode, Sens. Mater., Vol. 31, No. 7, 2019, p. 2183-2193.



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