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Vol. 32, No. 8(2), S&M2292

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Sensors and Materials
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Sensors and Materials, Volume 30, Number 3(1) (2018)
Copyright(C) MYU K.K.
pp. 347-354
S&M1496 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2018.1750
Published: February 28, 2018

Novel Thermal Convection Inclinometer [PDF]

Jium-Ming Lin and Cheng-Hung Lin

(Received July 3, 2017; Accepted October 20, 2017)

Keywords: thermal convection, inclinometer, xenon gas, thermal sensor, grooved cavity

In this research, we applied several new ideas for a novel thermal convection inclinometer design. (1) A flexible polyimide (PI) substrate was used instead of a silicon wafer so that the new design can reduce the energy loss of the heater to the substrate. (2) Both the heater and thermal sensors were formed directly on the PI substrate without floating over a grooved cavity on a silicon wafer so that the device is more reliable and cheaper. (3) Inert xenon gas was filled into a hemicylindrical chamber instead of the traditional CO2 gas in a rectangular one, so that we could not only increase the device sensitivity but reduce the oxidation effect. (4) A stacked layer of aluminum nitride was inserted under each thermal sensor to increase the device sensitivity. A prototype device was made to prove the performance of the new design.

Corresponding author: Jium-Ming Lin


Cite this article
Jium-Ming Lin and Cheng-Hung Lin, Novel Thermal Convection Inclinometer, Sens. Mater., Vol. 30, No. 3, 2018, p. 347-354.



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