pp. 61-74
S&M71 Research Paper Published: 1991 Application of Si-Wafer Direct Bonding to High-Temperature Integrated Pressure Sensors [PDF] Gwiy-Sang Chung, Shoji Kawahito, Makoto Ishida, Mitsuo Kawashima and Tetsuro Nakamura Cite this article Gwiy-Sang Chung, Shoji Kawahito, Makoto Ishida, Mitsuo Kawashima and Tetsuro Nakamura, Application of Si-Wafer Direct Bonding to High-Temperature Integrated Pressure Sensors, Sens. Mater., Vol. 3, No. 2, 1991, p. 61-74. |