Sensors and Materials
ISSN 0914-4935

Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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Room-temperature Hermetic Packaging Using Ultrasonic Cu–Cu Bonding with Compliant Rim

Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, and Tanemasa Asano

(Received April 23, 2018; Accepted July 4, 2018)

Keywords: hermetic packaging, compliant rim, room-temperature Cu-Cu bonding, ultrasonic bonding, MEMS packaging

In this paper, hermetic packaging using room-temperature (RT) Cu-Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was performed with ultrasonic assist at RT. Owing to the cone-shaped cross section of the compliant rim, it easily deforms under pressing load with ultrasonic assist and bonds to the counter Cu film at RT. As the result of a simple vacuum test, the air leak rate of the cavity inside the bonded sample was approximately 2×10 -11 Pa • m3/s, which is sufficiently low for applications of vacuum packaging of microdevices.

Corresponding author: Ryo Takigawa




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