Sensors and Materials

We will celebrate the 30th anniversary of Sensors and Materials in 2018.
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
To submit your manuscript, please use our Online Manuscript Submission System.

To subscribe to Sensors and Materials, please contact us.

Sensors and Materials
is covered by Science Citation Index Expanded (Thomson Reuters), Scopus (Elsevier), and other databases.

English    Japanese


 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3821-2930
 Fax: 81-3-3827-8547


ISSN 0914-4935

Cover of latest issue

Proofreading Services
MYU Group
provides English proofreading, translation, and recording services for your submissions and presentations. The quality of the services is highly regarded by many researchers in Japan and other Asian countries.

Myu Research

(proofreading and recording)
(Japanese Only)

(translation service)

The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials,
Volume 29, Number 9(1) (2017)

Copyright(C) MYU K.K. All Rights Reserved.
pp. 1275-1283
Online Published: September 6, 2017

Flexible Platinum Temperature sensor embedded in polyimide (PI) films for curved surface temperature monitoring applications: skin temperature of human body

Joon-Shik Park, Dong-Su Lee, Hyun Woo Nho, Dong-Sun Kim, Tae-Ho Hwang, and Nak-Kyu Lee

(Received February 17, 2017; Accepted April 28, 2017)

Keywords: flexibility, Pt, thin film, polyimide, curved surface, skin temperature, sensor

In this paper, we describe the design, fabrication, and characterization of a flexible platinum temperature sensor embedded in polyimide (PI) films for temperature monitoring applications on curved surfaces, such as the skin of a human body, and various tubes and pipes. In order to optimize and enhance the properties of the flexible temperature sensors, we investigated the effects of the designed thickness (0.5, 1.0, and 1.5 μm) and length (10, 50, 100, and 150 mm) of Pt thin-film electrodes embedded in PI films on the temperature coefficient of resistance (TCR) properties and sensitivities. The average TCRs for flexible temperature sensors with different lengths but identical thicknesses of Pt thin-film electrodes were 0.0027, 0.0029, and 0.0030 °C−1 for designed thicknesses of 0.5, 1.0, and 1.5 μm of Pt thin-film electrodes, respectively. The TCRs slightly increased when the thickness of the Pt electrodes increased. Meanwhile, thinner or longer Pt electrodes led to higher sensitivity for the temperature sensors. The highest sensitivity of a fabricated flexible temperature sensor was 15.59 Ω∙°C−1 in the device with a length of 150 mm and thickness of 0.5 μm. The bending effect on the change in the TCR of flexible temperature sensors, with radii of curvature of 5, 10, and 15 mm, was small. In order to confirm the performance of the fabricated flexible temperature sensor, actual skin temperatures of the palm and back of the hand were measured.

Corresponding author: Joon-Shik Park


Forthcoming Regular Issues

Forthcoming Special Issues

Special Issue on the 10th International Conference on Sensing Technology (ICST 2016)
Guest editor, Ruqiang Yan (Southeast University)
Conference website
Call for paper

3rd Special Issue on the Workshop on Next-Generation Front-Edge Optical Science Research
Guest editor, Hidehito Nanto (Kanazawa Institute of Technology)

Special Issue on Advanced Sensing Technology for Smart Manufacturing
Guest editor, Chien-Hung Liu (National Chung Hsing University)

Special Issue on International Conference on BioSensors, BioElectronics, BioMedical Devices, BioMEMS/NEMS and Applications 2016 (Bio4Apps 2016)
Guest editor, Dzung Dao (Griffith University)
Call for paper

Special Issue on Innovative and Intelligent Sensing Analysis and Experiment for Functional Materials
Guest editor, Cheng-Chi Wang (National Chin-Yi University of Technology)
Conference website

Special Issue on Retinal Prosthesis
Guest editor, Jun Ohta (Nara Institute of Science and Technology), Hiroyuki Tashiro (Kyusyu University), and Yasuo Terasawa (Nidek Co., Ltd.)
Call for paper

Special Issue Dedicated to Professor Toshitsugu Ueda for His Achievements
Guest editor, Satoshi Ikezawa (Waseda University) and Jinxing Liang (Southeast University)

Special Issue on ICASI2017
Guest editor, Teen-Hang Meen (National Formosa University), Shoou-Jinn Chang National Cheng Kung University), and Stephen D. Prior (University of Southampton)
Conference website
Call for paper

Special Issue on Open Collaboration for MEMS
Guest editor, Masayoshi Esashi (Tohoku University)

Special Issue on the International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017)
Guest editor, Wen-Hsiang Hsieh (National Formosa University)
Conference website

Special Issue on Internet of Things (IoT) and Applications for Improving Quality of Life
Guest editor, Hidetaka Nambo (Kanazawa University)
Call for paper

Special Issue on Materials, Devices, Circuits, Analytical Methods for Various Sensors (Selected Papers from ICSEVEN 2017)
Guest editor, Chien-Jung Huang (National University of Kaohsiung, Chi-Chih Liao (II-V Epiworks, Inc.), and Ja-Hao Chen (Feng Chia University)
Conference website
Call for paper

Special Issue on Sensors and Materials for Cyber-Physical Applications
Guest editor, Pitikhate Sooraksa (King Mongkut’s Institute of Technology Ladkrabang)
Call for paper

Special Issue on Biosensing Materials and Engineering for Electrobiology
Guest editor, Toshiya Sakata (The University of Tokyo)
Call for paper

Special Issue on Micro Energy Harvesting and Storing Technologies
Guest editor, Bin Yang (Shanghai Jiao Tong University)
Call for paper

Special Issue on Advances in Devices and Materials for Stress-Strain Sensing
Guest editor, Toshiyuki Toriyama and Taeko Ando (Ritsumeikan University)

Special Issue on Remote Sensing and Sensing Devices
Guest editor, Haruichi Kanaya (Kyushu University)
Call for paper

Copyright(C) MYU K.K. All Rights Reserved.