Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
To submit your manuscript, please use our Online Manuscript Submission System
To subscribe to Sensors and Materials, please contact us.
Sensors and Materials
is covered by Science Citation Index Expanded
(Thomson Reuters), Scopus
(Elsevier), and other databases.
Sensors and Materials
Bunkyo-ku, Tokyo 113-0022, Japan
Cover of latest issue
provides English proofreading, translation, and recording services for your submissions and presentations. The quality of the services is highly regarded by many researchers in Japan and other Asian countries.
(proofreading and recording)
The Art of Writing Scientific Papers
(How to write scientific papers)
Sensors and Materials, Volume 29, Number 6(2) (2017)
Copyright(C) MYU K.K. All Rights Reserved.
Published: June 21, 2017
Structure for Ultrasonic Suspension Gap Pressure Sensor
Masaya Takasaki, Ryutaro Chida, Shota Chino, Satoshi Morishita, Yuji Ishino, Kota Hosaka, Yoshio Mita, and Takeshi Mizuno
(Received September 21, 2016; Accepted January 4, 2017)
Keywords: pressure sensor, diaphragm, MEMS, ultrasonic vibration, non-contact suspension
It has been reported that an object can be suspended below a vibrating surface in air. We call this phenomenon ultrasonic suspension. When an object is suspended, a restoring force attracts the object horizontally to the center of the vibrating surface. Previously, characteristics of the forces acting vertically and horizontally were experimentally investigated using a servo-type measuring mechanism. While ultrasonic vibration was being excited, actuation forces acting on the object were measured. This characterization implied that negative pressure is generated in the suspension gap. To determine the principles governing these forces, the pressure distribution in the gap was investigated. Two types of pressure sensors were prepared. Measurements by these sensors did not agree with the characterized force, because a small hole at the measuring point in both sensors influenced the results. Therefore, we proposed a novel pressure sensor employing a diaphragm. Deflection of the diaphragm in proportion to applied pressure can be expected. The sensor was prototyped by micro-electromechanical system (MEMS) technology and calibrated. Results show that the deflection was proportional to the applied pressure and had no hysteresis.
Forthcoming Regular Issues
Forthcoming Special Issues
Special Issue on the International Multi-Conference on Engineering and Technology Innovation 2016 (IMETI2016) (1)
Guest editors, Wen-Hsiang Hsieh (National Formosa University)Special Issue on the International Multi-Conference on Engineering and Technology Innovation 2016 (IMETI2016) (2)
Guest editors, Wen-Hsiang Hsieh (National Formosa University)Special Issue on PEA Space Charge Measurement and its Discussion
Guest editors, Yasuhiro Tanaka (Tokyo City University)3rd Special Issue on the Workshop on Next-Generation Front-Edge Optical Science Research
Guest editors, Hidehito Nanto (Kanazawa Institute of Technology)Special Issue on Advanced Sensing Technology for Smart Manufacturing
Guest editors, Chien-Hung Liu (National Chung Hsing University)Special Issue on Recent Progress in the Optical Bio/Chemical Sensors
Guest editors, Yoshiaki Nishijima (Yokohama National University)Call for paperSpecial Issue on the 10th International Conference on Sensing Technology (ICST 2016)
Guest editors, Ruqiang Yan (Southeast University)Conference websiteCall for paperSpecial Issue on International Conference on BioSensors, BioElectronics, BioMedical Devices, BioMEMS/NEMS and Applications 2016 (Bio4Apps 2016)
Guest editors, Dzung Dao (Griffith University)Special Issue on Innovative and Intelligent Sensing Analysis and Experiment for Functional Materials
Guest editors, Cheng-Chi Wang (National Chin-Yi University of Technology)Special Issue on Retinal Prosthesis
Guest editors, Jun Ohta (Nara Institute of Science and Technology), Hiroyuki Tashiro (Kyusyu University), and Yasuo Terasawa (Nidek Co., Ltd.)Call for paperSpecial Issue Dedicated to Professor Toshitsugu Ueda for His Achievements
Guest editors, Satoshi Ikezawa (Waseda University) and Jinxing Liang (Southeast University)Special Issue on ICASI2017
Guest editors, Teen-Hang Meen (National Formosa University), Shoou-Jinn Chang National Cheng Kung University), and Stephen D. Prior (University of Southampton)Conference websiteCall for paperSpecial Issue on Open Collaboration for MEMS
Guest editors, Masaki Esashi (Tohoku University)Special Issue on the International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017)
Guest editors, Wen-Hsiang Hsieh (National Formosa University)Conference websiteSpecial Issue on Internet of Things (IoT) and Applications for Improving Quality of Life
Guest editors, Hidetaka Nambo (Kanazawa University)Call for paperSpecial Issue on Materials, Devices, Circuits, Analytical Methods for Various Sensors (Selected Papers from ICSEVEN 2017)
Guest editors, Chien-Jung Huang (National University of Kaohsiung, Chi-Chih Liao (II-V Epiworks, Inc.), and Ja-Hao Chen (Feng Chia University)Conference websiteCall for paper