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Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
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Sensors and Materials
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is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
Instructions to authors
English 日本語
Instructions for manuscript preparation
English 日本語
Template
English
Publisher
MYU K.K.
Sensors and Materials
1-23-3-303 Sendagi,
Bunkyo-ku, Tokyo 113-0022, Japan
Tel: 81-3-3827-8549
Fax: 81-3-3827-8547
MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.
MYU Research
(proofreading and recording)
MYU K.K.
(translation service)
The Art of Writing Scientific Papers
(How to write scientific papers)
(Japanese Only)
Sensors and Materials, Volume 28, Number 2 (2016)
Copyright(C) MYU K.K.
Copyright(C) MYU K.K.
|
pp. 163-171
S&M1166 Research Paper of Special Issue https://doi.org/10.18494/SAM.2016.1233 Published: February 24, 2016 Effect of Vacuum Annealing on Tensile Mechanical Characteristics of Au Bonding Wires [PDF] Akio Takagi, Takaaki Kato, Shugo Miyake, Shozo Inoue, and Takahiro Namazu (Received August 6, 2015; Accepted November 2, 2015) Keywords: Au bonding wire, tensile test, Young's modulus, yield strength, annealing, grain growth
In this paper, the effect of vacuum annealing on the mechanical properties of Au bonding wires is described. Au bonding wires with a diameter of 25 µm are subjected to quasi-static uniaxial tensile tests in laboratory air. The bonding wire specimens are prepared by attaching a wire to a Si frame fabricated by deep reactive ion etching (DRIE). The mean Young's modulus and 0.2% offset yield strength are 114 GPa and 354 MPa, respectively. By annealing at 100–300 ℃ for 10 min in vacuum, Young's modulus gradually decreases with increasing annealing temperature, whereas yield strength rapidly decreases in the annealed wires at temperatures above 200 ℃. The annealing effect is discussed on the basis of the change in the number of recrystallized grains in the wires.
Corresponding author: Takahiro Namazu Cite this article Akio Takagi, Takaaki Kato, Shugo Miyake, Shozo Inoue, and Takahiro Namazu, Effect of Vacuum Annealing on Tensile Mechanical Characteristics of Au Bonding Wires, Sens. Mater., Vol. 28, No. 2, 2016, p. 163-171. |
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