ISSN (print) 0914-4935
ISSN (online) 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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 Sensors and Materials
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Vol. 31 No. 12(2)
Special Issue on International Conference on BioSensors, BioElectronics, BioMedical Devices, BioMEMS/NEMS and Applications 2018/2019 (Bio4Apps 2018/2019)

Guest Editor: Xiaojun Han (Harbin Institute of Technology)

Preface

  • As a method of estimating the risk of heatstroke with a wearable device, we have developed a method of calculating the wet bulb globe temperature (WBGT) by estimating the black globe temperature ... Read More

  • Polymeric materials are used for vibration protection owing to their high-energy dissipation or adsorption. In this study, polyurethane elastomers (PUEs) were prepared using six kinds of chain e ... Read More

  • In this paper, we propose a low-frequency (<100 Hz) piezoelectric MEMS energy harvester (PMEH) with a two-degree-of-freedom (2DOF) structure to work in two vibration modes for broadband operation ... Read More

  • Two water-soluble polysilane derivatives were synthesized by the addition reaction of olefine acid with polysilane. After heating at 653 K and acidification, arc-discharged single-walled carbon ... Read More

  • A whole-cell-based amperometric biosensor was fabricated using Escherichia coli cells immobilized on a glassy carbon electrode to detect mercury, cadmium, and zinc ions. E. coli cells were immob ... Read More


S&M2069

Research Paper of Special Issue

S&M2069
Method of Estimating Heatstroke Risk Using Wristwatch-type Device
Yoshiyuki Kaiho, Seiichi Takamatsu, and Toshihito Itoh
pp. 4061-4068
https://doi.org/10.18494/SAM.2019.2452
Published on December 16, 2019
PDF (open access)

S&M2070

Research Paper of Special Issue

S&M2070
Investigation on Effects of Chain Extenders and Cross-linking Agents of Polyurethane Elastomers Using Independent Building Vibration Isolation Sensor
Taijiang Gui, Tianqi Xia, Hao Wei, Zhijia Zhang, and Xiao Ouyang
pp. 4069-4078
https://doi.org/10.18494/SAM.2019.2424
Published on December 16, 2019
PDF (open access)

S&M2071

Research Paper of Special Issue

S&M2071
Two-degree-of-freedom Piezoelectric MEMS Energy Harvester Based on Bulk PZT Film
Gang Tang, Gaoyang Xie, Bo Huang, Bin Xu, Zhibiao Li, Xiaoxiao Yan, Dandan Yuan, and Wenjing Wu
pp. 4079-4092
https://doi.org/10.18494/SAM.2019.2543
Published on December 16, 2019
PDF (open access)

S&M2072

Research Paper of Special Issue

S&M2072
Dispersion of Metallic Arc-discharged Single-walled Carbon Nanotubes by Two Polysilane Derivatives
Jinling Gao, Yongfu Lian, Chao Wen, and Hongmei Bi
pp. 4093-4101
https://doi.org/10.18494/SAM.2019.2446
Published on December 16, 2019
PDF (open access)

S&M2073

Research Paper of Special Issue

S&M2073
Microbial Electrode Sensor for Heavy-metal Ions
Xiaojun Han, Chao Li, and Daming Yong
pp. 4103-4111
https://doi.org/10.18494/SAM.2019.2645
Published on December 16, 2019
PDF (open access)

Cover of this Issue





Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on Novel Sensing Technologies for Point of Care, Home Care, and Personal Health Care
Guest editor, Yu-Lin Wang (National Tsing Hua University)


Special Issue on CMOS-driven Biomedical Innovations
Guest editor, Kiichi Niitsu (Nagoya University)


Special Issue on Advanced Materials on Electronic and Mechanical Devices and their Application on Sensors (5)
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)


Special Issue on Advances in Shape Memory Materials
Guest editor, Ryosuke Matsui (Aichi Institute of Technology) and Hiroyuki Miki (Tohoku University)


Special Issue on Perceptual Deep Learning in Computer Vision and its Application
Guest editor, Chih-Hsien Hsia (National Ilan University)


Special Issue on Materials, Devices, Circuits, and Analytical Methods for Various Sensors (3)
Guest editor, Chien-Jung Huang (National University of Kaohsiung), Cheng-Hsing Hsu (National United University), Ja-Hao Chen (Feng Chia University), and Wei-Ling Hsu (Huaiyin Normal University)
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