ISSN (print) 0914-4935
ISSN (online) 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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 Sensors and Materials
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Vol. 30 No. 12(2)
Special Issue on Remote Sensing and Sensing Devices

Guest Editor: Haruichi Kanaya (Kyushu University)

Preface

  • Thin films of poly(3,4-ethylenedioxythiophene) (PEDOT) were fabricated via the vapor-phase polymerization (VPP) of the monomer 3,4-ethylenedioxythiophene (EDOT) with FeCl3·6H2O as the oxidant. ... Read More

  • The luminescence spectroscopy of the Al2O3 is widely used for sensing the stress in Al2O3-based materials. One promising approach that improves the spatial resolution of the luminescence spectros ... Read More

  • To replace Al–Ge eutectic bonding, low-temperature direct Cu-to-Cu bonding was developed in this study. Lattice distortion and thus a hardened Cu subsurface conducted by air plasma bombardment ... Read More

  • In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was perfo ... Read More

  • Fine cone-shaped bumps (6 µm) were fabricated by a nanoparticle deposition method, where the nanoparticles were deposited onto hole patterns defined in a photoresist. In this work, the goal is ... Read More

  • We describe microgravity generation and the resolution evaluation results of a sub-1-mG microelectromechanical system (MEMS) accelerometer (1 G = 9.8 m/s2). To realize input acceleration below 1 ... Read More

  • Remote sensing has been providing solutions in a variety of sectors as a result of the recent growth in technology and available data. Land cover mapping is the most widely used application of r ... Read More

  • In this paper, an antenna sensor for a radio-wave-type endoscope to detect a blood vessel in fatty tissue is proposed. The antenna sensor consists of one transmitting antenna and two receiving a ... Read More

  • With the recent spread of the Internet of Things (IoT), smart devices are equipped with a number of sensors to collect data necessary for various applications. A wake-up radio (WUR) is considere ... Read More

  • We present a highly efficient power amplifier (PA) with an impedance-matched planar antenna. An impedance-matching network including inductors and capacitors is a common and essential practice f ... Read More


S&M1724

Research Paper of Special Issue

S&M1724
In situ Monitoring of Vapor-phase Polymerization and Characterization of Poly(3,4-ethylenedioxythiophene) Thin Films
Yasuko Koshiba, Mana Hirai, Shohei Horike, Masahiro Morimoto, Masahiro Misaki, Tastuya Fukushima, and Kenji Ishida
pp. 2873-2879
https://doi.org/10.18494/SAM.2018.1986
Published on December 18, 2018
PDF (open access)

S&M1725

Research Paper of Special Issue

S&M1725
Asymmetric Line Shape of Near-field Luminescence Spectrum Induced by Stress in Al2O3
Toru Tomimatsu and Ryo Takigawa
pp. 2881-2888
https://doi.org/10.18494/SAM.2018.2019
Published on December 18, 2018
PDF (open access)

S&M1726

Research Paper of Special Issue

S&M1726
Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging
Jenn-Ming Song, Sin-Yong Liang, Zong-Yu Xie, Po-Hao Chiang, Shang-Kun Huang, Ying-Ta Chiu, David Tarng, Chih-Pin Hung, and Jing-Yuan Lin
pp. 2889-2895
https://doi.org/10.18494/SAM.2018.1948
Published on December 18, 2018
PDF (open access)

S&M1727

Research Paper of Special Issue

S&M1727
Room-temperature Hermetic Packaging Using Ultrasonic Cu–Cu Bonding with Compliant Rim
Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, and Tanemasa Asano
pp. 2897-2903
https://doi.org/10.18494/SAM.2018.1967
Published on December 18, 2018
PDF (open access)

S&M1728

Research Paper of Special Issue

S&M1728
Fine Cone-shaped Bumps for Three-dimensional LSI Package—An Optimization of Thermocompression Bonding Process
Shunsuke Nemoto, Ying Ying Lim, Hiroshi Nakagawa, Katsuya Kikuchi, and Masahiro Aoyagi
pp. 2905-2917
https://doi.org/10.18494/SAM.2018.2009
Published on December 18, 2018
PDF (open access)

S&M1729

Research Paper of Special Issue

S&M1729
Microgravity Generation Using Tilting Board for Resolution Evaluation of MEMS Accelerometer
Motohiro Takayasu, Ippei Tsuji, Hiroyuki Ito, Daisuke Yamane, Shiro Dosho, Toshifumi Konishi, Noboru Ishihara, Katsuyuki Machida, and Kazuya Masu
pp. 2919-2926
https://doi.org/10.18494/SAM.2018.1840
Published on December 18, 2018
PDF (open access)

S&M1730

Research Paper of Special Issue

S&M1730
Exploring Land Cover Classification Accuracy of Landsat 8 Image Using Spectral Index Layer Stacking in Hilly Region of South Korea
Jae Kang Lee, Tri Dev Acharya, and Dong Ha Lee
pp. 2927-2941
https://doi.org/10.18494/SAM.2018.1934
Published on December 18, 2018
PDF (open access)

S&M1731

Research Paper of Special Issue

S&M1731
Antenna Sensor for Radio-wave-type Endoscope
Takafumi Fujimoto, Keiya Kawashima, Genki Horiguchi, and Toshiyuki Tanaka
pp. 2943-2959
https://doi.org/10.18494/SAM.2018.1965
Published on December 18, 2018
PDF (open access)

S&M1732

Research Paper of Special Issue

S&M1732
Wake-up Radio-resilient Scanning Mechanism for Mobile Device in IEEE 802.11ba
Hyunhee Park and Eui-Jik Kim
pp. 2961-2968
https://doi.org/10.18494/SAM.2018.1961
Published on December 18, 2018
PDF (open access)

S&M1733

Research Paper of Special Issue

S&M1733
Impedance-matched Planar-antenna-integrated High-efficiency Push-pull Power Amplifier with Center-tapped Transformer for 5 GHz Wireless Communication
Takeshi Kuboki, Tomoki Sadakiyo, Wee Sang Park, and Haruichi Kanaya
pp. 2969-2978
https://doi.org/10.18494/SAM.2018.2025
Published on December 18, 2018
PDF (open access)

Cover of this Issue





Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on Design, Fabrication, Characterization, and Application MEMS
Guest editor, Hiroyuki Fujita (Tokyo City University)


Special Issue on Magnetic Sensors and Applications & Regular Issue
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Special Issue on Selected Papers from AUTO2018 and IS3C2018 (2)
Guest editor, Hsiung-Cheng Lin (National Chin-Yi University of Technology)


Special Issue on New Trend of Robotics and Applications
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Special Issue on Universal Power Supply Technologies for Trillion Sensors Era
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Special Issue on Sensors and Materials in Manufacturing
Guest editor, Ming Yang (Tokyo Metropolitan University) and Masao Murakawa (Nippon Institute of Technology)


Special Issue on Remote Sensing and Geospatial Technologies for Sustainable Development
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Special Issue on CMOS-driven Biomedical Innovations
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Special Issue on Smart Sensing Technology and Materials for Smart Industry and Environmental Applications
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Special Issue on Advanced Materials on Electronic and Mechanical Devices and their Application on Sensors
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Special Issue on Advanced Micro and Nanomaterials for various Sensor Applications (Selected Papers from ICASI 2019)
Guest editor, Sheng-Joue Young (National Formosa University), Shoou-Jinn Chang (National Cheng Kung University), Liang-Wen Ji (National Formosa University), and Yu-Jen Hsiao (Southern Taiwan University of Science and Technology)
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Special Issue on Materials, Devices, Circuits, Analytical Methods for Various Sensors (Selected Papers from ICSEVEN 2019)
Guest editor, Chien-Jung Huang (National University of Kaohsiung), Cheng-Hsing Hsu (National United University), Ja-Hao Chen (Feng Chia University), and Wei-Ling Hsu (Huaiyin Normal University)
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Special Issue on Biological Odor Sensing System and Their Applications
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Special Issue on Novel Sensing Technologies for Point of Care, Home Care, and Personal Health Care
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