ISSN (print) 0914-4935
ISSN (online) 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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Instructions for manuscript preparation
English    日本語

Template
English

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 MYU K.K.
 Sensors and Materials
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The Art of Writing Scientific Papers

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Vol. 26 No. 6
Special Issue on WUPP for III-nitrides

Guest Editor: Hideo Aida (Namiki Precision Jewel Co., Ltd./Kyushu University)



S&M1006

Research Paper of Special Issue

S&M1006
Ammonothermal Bulk GaN Growth and Its Processing
Tadao Hashimoto, Edward Letts, Daryl Key, Keith Male, Matthew Michaels and Sierra Hoff
pp. 385-392
https://doi.org/10.18494/SAM.2014.976
Published on July 29, 2014
PDF

S&M1007

Research Paper of Special Issue

S&M1007
Sapphire Substrate Processing for High-Performance GaN-Based Light-Emitting Diodes -Micropatterning of Sapphire Substrates and Its Effect on Light Enhancement in GaN-Based Light-Emitting Diodes-
Natsuko Aota, Hideo Aida, Yutaka Kimura and Yuki Kawamata
pp. 393-402
https://doi.org/10.18494/SAM.2014.974
Published on July 29, 2014
PDF

S&M1008

Research Paper of Special Issue

S&M1008
Novel Chemical Mechanical Polishing/Plasma-Chemical Vaporization Machining (CMP/P-CVM) Combined Processing of Hard-to-Process Crystals Based on Innovative Concepts
Toshiro K. Doi, Yasuhisa Sano, Syuhei Kurowaka, Hideo Aida, Osamu Ohnishi, Michio Uneda and Koki Ohyama
pp. 403-415
https://doi.org/10.18494/SAM.2014.978
Published on July 29, 2014
PDF

S&M1009

Research Paper of Special Issue

S&M1009
Micro-Laser-Assisted Machining: The Future of Manufacturing Ceramics and Semiconductors
Deepak Ravindra and John Patten
pp. 417-427
https://doi.org/10.18494/SAM.2014.977
Published on July 29, 2014
PDF

S&M1010

Research Paper of Special Issue

S&M1010
Dependence of GaN Removal Rate of Plasma Chemical Vaporization Machining on Mechanically Introduced Damage
Yasuhisa Sano, Toshiro K. Doi, Syuhei Kurokawa, Hideo Aida, Osamu Ohnishi, Michio Uneda, Kousuke Shiozawa, Yu Okada and Kazuto Yamauchi
pp. 429-434
https://doi.org/10.18494/SAM.2014.979
Published on July 29, 2014
PDF

S&M1011

Research Paper of Special Issue

S&M1011
Influence of Pad Surface Asperity on Removal Rate in Chemical Mechanical Polishing of Large-Diameter Silicon Wafer Applied to Substrate of GaN-Based LEDs
Michio Uneda, Yuki Maeda, Kazutaka Shibuya, Yoshio Nakamura, Daizo Ichikawa, Kiyomi Fujii and Ken-ichi Ishikawa
pp. 435-445
https://doi.org/10.18494/SAM.2014.975
Published on July 29, 2014
PDF

S&M1012

Research Paper

S&M1012
Design and Trial Production of Microstructured ZnO Gas Sensor
Qiulin Tan, Chao Li, Wenyi Liu, Chenyang Xue, Wendong Zhang, Jun Liu, Xiaxia Ji and Jijun Xiong
pp. 447-459
https://doi.org/10.18494/SAM.2014.966
Published on July 29, 2014
PDF

Cover of this Issue





Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on Novel Sensing Technologies for Point of Care, Home Care, and Personal Health Care
Guest editor, Yu-Lin Wang (National Tsing Hua University)


Special Issue on CMOS-driven Biomedical Innovations
Guest editor, Kiichi Niitsu (Nagoya University)


Special Issue on Advanced Materials on Electronic and Mechanical Devices and their Application on Sensors (5)
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)


Special Issue on Advances in Shape Memory Materials
Guest editor, Ryosuke Matsui (Aichi Institute of Technology) and Hiroyuki Miki (Tohoku University)


Special Issue on Perceptual Deep Learning in Computer Vision and its Application
Guest editor, Chih-Hsien Hsia (National Ilan University)


Special Issue on Materials, Devices, Circuits, and Analytical Methods for Various Sensors (3)
Guest editor, Chien-Jung Huang (National University of Kaohsiung), Cheng-Hsing Hsu (National United University), Ja-Hao Chen (Feng Chia University), and Wei-Ling Hsu (Huaiyin Normal University)
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