Young Researcher Paper Award 2023
🥇Winners

Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Instructions to authors
English    日本語

Instructions for manuscript preparation
English    日本語

Template
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3827-8549
 Fax: 81-3-3827-8547

MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials, Volume 21, Number 7 (2009)
Copyright(C) MYU K.K.
pp. 373-383
S&M777 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2009.603
Published: October 22, 2009

Fabrication of Carbon Nanotube Via Interconnects at Low Temperature and Their Robustness over a High-Density Current [PDF]

Shintaro Sato, Akio Kawabata, Tatsuhiro Nozue, Daiyu Kondo, Tomo Murakami, Takashi Hyakushima, Mizuhisa Nihei and Yuji Awano

(Received June 1, 2009; Accepted June 8, 2009)

Keywords: carbon nanotube, LSI, interconnect, via, growth, low temperature, catalyst, nanoparticle, particle, impactor

We fabricated carbon nanotube (CNT) via interconnects (vertical wiring) and evaluated their robustness over a high-density current. Multiwalled carbon nanotubes (MWNTs) were grown at temperatures as low as 365°C using Co catalyst nanoparticles, which were formed and deposited by a custom-designed particle generation and deposition system. MWNTs were successfully grown in via holes with a diameter as small as 40 nm. The resistance of CNT vias with a diameter of 160 nm was found to be of the same order as that of tungsten plugs. The CNT vias were able to sustain a current density as high as 5.0×106 A/cm2 at 105°C for 100 h without any deterioration in their properties.

Corresponding author: Shintaro Sato


Cite this article
Shintaro Sato, Akio Kawabata, Tatsuhiro Nozue, Daiyu Kondo, Tomo Murakami, Takashi Hyakushima, Mizuhisa Nihei and Yuji Awano, Fabrication of Carbon Nanotube Via Interconnects at Low Temperature and Their Robustness over a High-Density Current, Sens. Mater., Vol. 21, No. 7, 2009, p. 373-383.



Forthcoming Regular Issues


Forthcoming Special Issues

Applications of Novel Sensors and Related Technologies for Internet of Things
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
Call for paper


Special Issue on Advanced Data Sensing and Processing Technologies for Smart Community and Smart Life
Guest editor, Tatsuya Yamazaki (Niigata University)
Call for paper


Special Issue on Advanced Sensing Technologies and Their Applications in Human/Animal Activity Recognition and Behavior Understanding
Guest editor, Kaori Fujinami (Tokyo University of Agriculture and Technology)
Call for paper


Special Issue on International Conference on Biosensors, Bioelectronics, Biomedical Devices, BioMEMS/NEMS and Applications 2023 (Bio4Apps 2023)
Guest editor, Dzung Viet Dao (Griffith University) and Cong Thanh Nguyen (Griffith University)
Conference website
Call for paper


Special Issue on Piezoelectric Thin Films and Piezoelectric MEMS
Guest editor, Isaku Kanno (Kobe University)
Call for paper


Special Issue on Advanced Micro/Nanomaterials for Various Sensor Applications (Selected Papers from ICASI 2023)
Guest editor, Sheng-Joue Young (National United University)
Conference website
Call for paper


Copyright(C) MYU K.K. All Rights Reserved.