Young Researcher Paper Award 2023
🥇Winners

Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Instructions to authors
English    日本語

Instructions for manuscript preparation
English    日本語

Template
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3827-8549
 Fax: 81-3-3827-8547

MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials, Volume 33, Number 5(2) (2021)
Copyright(C) MYU K.K.
pp. 1577-1587
S&M2556 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2021.3046
Published: May 12, 2021

Hole Filling in Image Conversion Using Weighted Local Gradients [PDF]

Yung-Wen Lee, Dong-Meau Chang, Chun-Chi Chen, and Chyuan-Huei Thomas Yang

(Received July 20, 2020; Accepted March 8, 2021)

Keywords: image conversion, weighted local gradients, hole filling, morphological operations

Three-dimensional displays have become an important medium. Most of the 3D content for these displays is converted from 2D content. The conversion requires appropriate depth information from 2D images, but the information is insufficient to create high-quality 3D images in many cases. Therefore, converting 2D images into 3D images has become an important issue in emerging 3D applications. As even sophisticated equipment produces noise, cracks, and holes in the converted images, the conversion requires an improved method for creating high-quality 3D images, especially a hole-filling method. This method is one of the techniques in depth image-based rendering (DIBR), which converts 2D single-depth images into 3D images by using a multiangle virtual view and stereoscopic image generation. We propose a new algorithm for hole filling in DIBR that converts 2D images into 3D images by maintaining the depth structure of occlusions and performing morphological operations on images and the background depth levels. This algorithm uses edge information, morphology, gradient vector flow, and weighted local gradients to render holes. Multiview images generated by the proposed algorithm have synthesized virtual views of better quality than those generated by previous methods.

Corresponding author: Chyuan-Huei Thomas Yang


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.

Cite this article
Yung-Wen Lee, Dong-Meau Chang, Chun-Chi Chen, and Chyuan-Huei Thomas Yang, Hole Filling in Image Conversion Using Weighted Local Gradients, Sens. Mater., Vol. 33, No. 5, 2021, p. 1577-1587.



Forthcoming Regular Issues


Forthcoming Special Issues

Applications of Novel Sensors and Related Technologies for Internet of Things
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
Call for paper


Special Issue on Advanced Data Sensing and Processing Technologies for Smart Community and Smart Life
Guest editor, Tatsuya Yamazaki (Niigata University)
Call for paper


Special Issue on Advanced Sensing Technologies and Their Applications in Human/Animal Activity Recognition and Behavior Understanding
Guest editor, Kaori Fujinami (Tokyo University of Agriculture and Technology)
Call for paper


Special Issue on International Conference on Biosensors, Bioelectronics, Biomedical Devices, BioMEMS/NEMS and Applications 2023 (Bio4Apps 2023)
Guest editor, Dzung Viet Dao (Griffith University) and Cong Thanh Nguyen (Griffith University)
Conference website
Call for paper


Special Issue on Piezoelectric Thin Films and Piezoelectric MEMS
Guest editor, Isaku Kanno (Kobe University)
Call for paper


Special Issue on Advanced Micro/Nanomaterials for Various Sensor Applications (Selected Papers from ICASI 2023)
Guest editor, Sheng-Joue Young (National United University)
Conference website
Call for paper


Copyright(C) MYU K.K. All Rights Reserved.