Notice of retraction
Vol. 32, No. 8(2), S&M2292

ISSN (print) 0914-4935
ISSN (online) 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Instructions to authors
English    日本語

Instructions for manuscript preparation
English    日本語

Template
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3827-8549
 Fax: 81-3-3827-8547

MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials, Volume 32, Number 8(3) (2020)
Copyright(C) MYU K.K.
pp. 2851-2858
S&M2305 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2020.2893
Published in advance: July 31, 2020
Published: August 31, 2020

Enhancement of Fatigue Properties in Sensor Element by Surface Modification [PDF]

Kohei Takeda

(Received March 31, 2020; Accepted July 14, 2020)

Keywords: sensor element, shape memory alloy, superelasticity, ultrasonic shot peening, fatigue

The fatigue property of TiNi shape memory alloy (SMA) is one of the important issues for its use as a sensor element. In this study, the fatigue life of TiNi SMA was improved by ultrasonic shot peening (USP), which can provide the same or a better effect than general shot peening. The effects of the residual stress, surface roughness, and fatigue crack initiation position on the fatigue life of TiNi SMA wires treated by USP were investigated. The results obtained are summarized as follows. (1) The value of the upper stress plateau under the loading process is increased by USP. The increase in stress is almost proportional to the coverage. (2) In the rotating-bending fatigue test, the fatigue life is improved by USP with coverages of 200, 1000, and 2000%. (3) The higher the coverage, the higher the percentage of fatigue cracks that appear from the specimen surface in USP specimens.

Corresponding author: Kohei Takeda


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.

Cite this article
Kohei Takeda, Enhancement of Fatigue Properties in Sensor Element by Surface Modification, Sens. Mater., Vol. 32, No. 8, 2020, p. 2851-2858.



Forthcoming Regular Issues


Forthcoming Special Issues

Special issue on Novel Materials and Sensing Technologies on Electronic and Mechanical Devices (2)-1
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Hsien-Wei Tseng (Longyan University)


Special Issue on Materials, Devices, Circuits, and Analytical Methods for Various Sensors (4)
Guest editor, Chien-Jung Huang (National University of Kaohsiung), Cheng-Hsing Hsu (National United University), Ja-Hao Chen (Feng Chia University), and Wei-Ling Hsu (Huaiyin Normal University)
Conference website


Special issue on Novel Materials and Sensing Technologies on Electronic and Mechanical Devices (2)-2
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Hsien-Wei Tseng (Longyan University)


Special Issue on New Trends in Robots and Their Applications
Guest editor, Ikuo Yamamoto (Nagasaki University)


Special Issue on Artificial Intelligence in Sensing Technologies and Systems
Guest editor, Prof. Lin Lin (Dalian University of Technology)
Call for paper


Special issue on Novel Materials and Sensing Technologies on Electronic and Mechanical Devices (3)
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Hsien-Wei Tseng (Longyan University)


Copyright(C) MYU K.K. All Rights Reserved.