S&M Young Researcher Paper Award 2020
Recipients: Ding Jiao, Zao Ni, Jiachou Wang, and Xinxin Li [Winner's comments]
Paper: High Fill Factor Array of Piezoelectric Micromachined
Ultrasonic Transducers with Large Quality Factor

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Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials, Volume 32, Number 8(3) (2020)
Copyright(C) MYU K.K.
pp. 2825-2839
S&M2303 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2020.2887
Published: August 31, 2020

Constitutive Modeling of Shape Memory Alloy Including Martensite-transformation-induced Plasticity [PDF]

Tadashige Ikeda

(Received March 27, 2020; Accepted July 7, 2020)

Keywords: constitutive model, shape memory alloy, cyclic deformation, phase transformation, martensite-transformation-induced plasticity

The stress–strain curves of as-received shape memory alloys (SMAs), which are often used as sensors or/and actuators, vary among cyclic loadings. This phenomenon is caused by an irreversible process induced by the martensite transformation. To reproduce it mathematically, the one-dimensional phase transformation model previously proposed by the present author and his coworkers is developed. Specifically, new phases composed of the austenitic phase and the residual martensitic phase are introduced. To verify the validity of the model, cyclic tensile loading tests of as-received superelastic SMA wires are carried out and the measured stress–strain curves are compared with those obtained by calculation. The result shows that the present model can reproduce the variation of the stress–strain curve for the first several cycles with reasonable accuracy.

Corresponding author: Tadashige Ikeda


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Cite this article
Tadashige Ikeda, Constitutive Modeling of Shape Memory Alloy Including Martensite-transformation-induced Plasticity, Sens. Mater., Vol. 32, No. 8, 2020, p. 2825-2839.



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