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Vol. 32, No. 8(2), S&M2292

ISSN (print) 0914-4935
ISSN (online) 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials, Volume 32, Number 8(3) (2020)
Copyright(C) MYU K.K.
pp. 2841-2849
S&M2304 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2020.2886
Published: August 31, 2020

Finite Element Method Analysis of Effect of Thickness of Tape-shaped Ti–Ni Shape Memory Alloy on Post-buckling Behavior [PDF]

Takumi Ishii, Hiroki Cho, Atsushi Urakawa, and Takumi Sasaki

(Received March 27, 2020; Accepted June 26, 2020)

Keywords: shape memory alloy, Ti–Ni alloy, buckling deformation, FEM analysis, negative stiffness

A tape-shaped Ti–Ni shape memory alloy (SMA) element, which demonstrates superelastic behavior, shows negative stiffness during post-buckling deformation. This characteristic is applied to a passive vibration-free system using a zero-stiffness structure. However, the post-buckling behavior (negative stiffness) of an SMA element can be varied by modifying its dimensions. In this study, the effect of the thickness of a tape-shaped SMA element on its post-buckling behavior is investigated by finite element method (FEM) analysis. The magnitude of the negative stiffness increases with the thickness. Furthermore, the rate of increase of the volume fraction of the martensitic phase before the start of buckling deformation increases with the thickness. From these results, we conclude that the magnitude of negative stiffness during the post-buckling of a tape-shaped SMA element depends on the variation of the volume fraction of the martensitic phase during buckling deformation.

Corresponding author: Hiroki Cho


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Cite this article
Takumi Ishii, Hiroki Cho, Atsushi Urakawa, and Takumi Sasaki, Finite Element Method Analysis of Effect of Thickness of Tape-shaped Ti–Ni Shape Memory Alloy on Post-buckling Behavior, Sens. Mater., Vol. 32, No. 8, 2020, p. 2841-2849.



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