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Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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Sensors and Materials, Volume 32, Number 2(1) (2020)
Copyright(C) MYU K.K.
pp. 563-572
S&M2122 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2020.2530
Published: February 10, 2020

Package Reliability Verification of Vanadium Oxide Thin-film Element [PDF]

Beom-Su Kim, Bong-Jun Kim, Sungkwan-Youm, and Dae-Hee Park

(Received June 30, 2019; Accepted January 19, 2020)

Keywords: vanadium oxide, VO2/AIN/Si, MIT, sensor, resistance, reliability

Vanadium oxide (VO2) is a typical metal–insulator transition (MIT) material currently receiving considerable attention because of its MIT occurring at the transition temperature TC of 67 ℃. In this study, VO2/AlN/Si MIT devices with specific temperature sensor characteristics were designed and packaged for commercial use, and their temperature resistance and humidity dependences were studied to determine whether the characteristics of the elements changed over time. Clear epoxy was used as a packaging material. Reliability tests were conducted by fabricating two oxide device package types: SMD 1608 and a 3Φ lamp package used for light-emitting diodes. In high-temperature (60 ℃) storage, low-temperature (−25 ℃) storage, and high-temperature (60 ℃) operation tests, the resistance change was 10% compared with the initial resistance. However, in the high-temperature/high-humidity test (85 ℃/85% RH), the resistance increased by 20%, and the resistance also decreased on the order of 103. Furthermore, when epoxy was applied to each package after conducting a high-temperature/ high-humidity test, the resistance increased by 22%.

Corresponding author: Sungkwan-Youm, Dae-Hee Park


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Cite this article
Beom-Su Kim, Bong-Jun Kim, Sungkwan-Youm, and Dae-Hee Park, Package Reliability Verification of Vanadium Oxide Thin-film Element, Sens. Mater., Vol. 32, No. 2, 2020, p. 563-572.



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