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Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
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Sensors and Materials, Volume 30, Number 12(2) (2018)
Copyright(C) MYU K.K.
pp. 2897-2903
S&M1727 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2018.1967
Published: December 18, 2018

Room-temperature Hermetic Packaging Using Ultrasonic Cu–Cu Bonding with Compliant Rim [PDF]

Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, and Tanemasa Asano

(Received April 23, 2018; Accepted July 4, 2018)

Keywords: hermetic packaging, compliant rim, room-temperature Cu–Cu bonding, ultrasonic bonding, MEMS packaging

In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was performed with ultrasonic assist at RT. Owing to the cone-shaped cross section of the compliant rim, it easily deforms under pressing load with ultrasonic assist and bonds to the counter Cu film at RT. As a result of a simple vacuum test, the air leak rate of the cavity inside the bonded sample was approximately 2 × 10−11 Pa·m3/s, which may be sufficiently low for applications of vacuum packaging of microdevices.

Corresponding author: Ryo Takigawa


Cite this article
Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, and Tanemasa Asano, Room-temperature Hermetic Packaging Using Ultrasonic Cu–Cu Bonding with Compliant Rim, Sens. Mater., Vol. 30, No. 12, 2018, p. 2897-2903.



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