Notice of retraction
Vol. 32, No. 8(2), S&M2292

ISSN (print) 0914-4935
ISSN (online) 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
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Sensors and Materials, Volume 14, Number 4 (2002)
Copyright(C) MYU K.K.
pp. 189-198
S&M481 Research Paper of Special Issue
Published: 2002

Optical Addressing of Polymer Beads in Microdevices [PDF]

Mihrimah Ozkan, Sangeeta Bhatia and Sadik C. Esener

Keywords: optical addressing, lab-on-a-chip, microdevices, μTAS, biomems

Integrated 'lab-on-a-chip' devices that utilize microfabrication tools are emerging for chemical and biological applications. Facile, robust sample manipulation within these devices will be particularly important for realizing the potential to perform many assays in parallel. Often, biomolecules are manipulated by derivatization to larger 'carrier beads'; therefore, we have developed a novel optical addressing scheme to localize polymer beads (0.8-10 µm in diameter) on an unpatterned semiconductor surface. This approach utilizes an optical microbeam that is directed on the substrate to create an active 'virtual' electrode. The localized charge is defined by the characteristics of the solid-liquid interface in the electrochemical system and serves to attract oppositely charged objects within the solution. Furthermore, to improve patterning efficiency and resolution, a photosensitive polymer coating is used on semiconductor substrates to minimize undesired effects of the dark current. Thus, illumination through a mask or use of multiple beams enables a nonlithographic, dynamic pattern transfer to a uniform substrate. In the future, this approach may be useful for 'off-chip', sterile manipulation of arrays of 'carrier beads' for high-throughput applications.


Cite this article
Mihrimah Ozkan, Sangeeta Bhatia and Sadik C. Esener, Optical Addressing of Polymer Beads in Microdevices, Sens. Mater., Vol. 14, No. 4, 2002, p. 189-198.



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