Sensors and Materials
Contents
 
  MYU
Sensors and Materials
1-23-3-303 Sendagi, Bunkyo-ku, Tokyo 113-0022, Japan
Tel: 81-3-3821-2930
Fax: 81-3-3827-8547
 




Sensors and Materials  ISSN 0914-4935

Volume 17 (2005)
Number 6

Special Issue on Wafer Bonding and Its Applications
Guest Editor, Qin-Yi Tong (Ziptronix, Inc.)


Research Reports

S&M0609
Room Temperature Direct Wafer Bonding for Three Dimensional Integrated Sensors
Paul Enquist
pp. 307-316
[Abstract]


S&M0610
Locating and Tracking the Evolution of Debonds at the Interface of Bonded Semiconductor Devices Using Infrared Photoelasticity
Gavin Horn, Thomas J. Mackin and Jon Lesniak
pp. 317-333
[Abstract]


S&M0611
Effects of Implantation Heating on Exfoliation of InP
Sumiko Hayashi, Rajinder Sandhu, David Bruno, Mike Wojtowicz and Mark S. Goorsky
pp. 335-341
[Abstract]


S&M0612
Introduction of InP-Based Light Emitter into GaAs-Based 3D Photonic Crystal by Improved Wafer Bonding of Dissimilar Materials
Masahiro Imada, Shinpei Ogawa, Susumu Yoshimoto and Susumu Noda
pp. 343-353
[Abstract]




Copyright(C) MYU K.K. All Rights Reserved.