Sensors and Materials
Sensors and Materials
1-23-3-303 Sendagi, Bunkyo-ku, Tokyo 113-0022, Japan
Tel: 81-3-3821-2930
Fax: 81-3-3827-8547

Sensors and Materials  ISSN 0914-4935

Volume 6 (1994)
Number 2

Special Issue on Microsensor Modeling (1)
Guest Editor, Arokia Nathan (University of Waterloo)

Research Reports

Numerical Modelling of Time Response of CMOS Micromachined Thermistor Sensor
Walter Allegretto, Bing Shen, Zhongsheng Lai and Alexander M. Robinson
pp. 71-83

Self-Consistent Electromechanical Analysis of Complex 3-D Microelectromechanical Structures Using Relaxation/Multipole-Accelerated Method
Xuejun Cai, Peter Osterberg, He Yie, John Gilbert, Steve Senturia and Jacob White
pp. 85-99

Use of SPICE for Modeling Silicon-Based Chemical Sensors
Giuseppe Massobrio, Sergio Martinoia and Massimo Grattarola
pp. 101-123

Thermodynamic Analysis of Semiconductor Structures Using a Device Simulator and Lumped Circuit Modelling
Ton J. Mouthaan and Benno H. Krabbenborg
pp. 125-137

Copyright(C) MYU K.K. All Rights Reserved.