Sensors and Materials

We will celebrate the 30th anniversary of Sensors and Materials in 2018.
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
To submit your manuscript, please use our Online Manuscript Submission System.

To subscribe to Sensors and Materials, please contact us.

Sensors and Materials
is covered by Science Citation Index Expanded (Thomson Reuters), Scopus (Elsevier), and other databases.

Guidelines
English    Japanese

Templates
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3821-2930
 Fax: 81-3-3827-8547

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ISSN 0914-4935

Cover of latest issue




Proofreading Services
MYU Group
provides English proofreading, translation, and recording services for your submissions and presentations. The quality of the services is highly regarded by many researchers in Japan and other Asian countries.


Myu Research

(proofreading and recording)
(Japanese Only)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Instructions to Authors


Submission policy:

Manuscripts submitted to this journal must not have been previously published or be currently under consideration for publication elsewhere. The authors should not withdraw their manuscript after submission without special reason.

Copyright transfer:

The authors of an accepted manuscript shall agree to transfer the copyright of the manuscript to MYU K.K.

Permission request:

After publication, the authors of an accepted manuscript are allowed to publish its PDF file on their own academic website by requesting permission to the Editorial Department. In that website, please provide the DOI of the manuscript. If the authors need to use part of their manuscript in other books or journals, please submit a permission request form to the Editorial Department.
Permission Request Form

Use of figures:

The authors must obtain formal permission from relevant publishers to use the figures and tables shown in the already published manuscripts. The reference numbers should be appropriately given in the main text and figure and table captions to clarify the source.

Publication fee:

The authors will be obliged to pay the publication fee determined in accordance with the number of pages published in Sensors and Materials upon acceptance of the manuscript for publication (e.g., JPY 95040 or equivalent in USD for 10 pages in Sensors and Materials format, as of 2017). For details, please see the guidelines or contact the Editorial Department.

Withdrawal:

If the authors withdraw their manuscript once it has been accepted for publication, the authors should pay the cancellation fee, which will be determined in accordance with the time the authors informed us of the cancellation. Even if the authors withdraw their manuscript after it has been published, the publication fee will not be refunded. For details, please contact the Editorial Department.

Manuscripts

Manuscripts must be typewritten (double spaced) on A4 white sheets and should be prepared in a MS Word or PDF format (font, Times New Roman). The text should have an approximately 3 cm margin on all sides. Provide the e-mail address of the corresponding author (one, as a rule). Please submit your manuscript using our Online Manuscript Submission System or as an e-mail attachment (e-mail, myukk@myu-inc.jp).

Types of manuscript:

Contributions should be specified as research papers, review papers, perspectives, technical papers, and letters.

Research papers
Research papers are original papers with comprehensive and detailed description of the research work. The originality, technical quality, and impact of the research work are evaluated. In principle, research papers consists of the following parts: (1) Title, (2) Authors, (3) Affiliations, (4) Keywords, (5) Abstract, (6) Introduction, (7) Materials and Methods, (8) Results, (9) Discussion, (10) Conclusions, (11) Acknowledgements, (12) References, and (13) Figure and Table Captions. They must provide sufficient information to ensure the repeatability of experiments and analyses by other researchers. The length of research papers is generally more than six pages in the Sensors and Materials format.

Review papers
Review papers should present overviews of a specific subject or technical area related to sensors and materials in a comprehensive manner so that the readers become familiar with the state-of-the-art research at the time the review paper was prepared. How well the review paper provides overviews of the specific subject is evaluated. Review papers should use bibliographic references to relate to pertinent technical literature. No limitation on length is specified. In general, review papers are written by authorities of the field who have been involved in the research for many years.

Perspectives
Perspectives are manuscripts on a new subject that is expected to make a significant contribution to the field of sensors and materials in the future. They should provide insight into the subject so that nonspecialists can understand it.

Technical papers
Technical papers are short review papers generally discussing a specific subject related to sensors and materials or introductory papers on research cases (e.g., significant improvements in instrumentation, fabrication processes, and measurement techniques). Technical papers are shorter than review papers. The criteria for the acceptance of technical papers are less strict than those for review papers.

Letters
Letters are short papers on timely developments that require rapid publication. The length of a letter is approximately four or five pages in the Sensors and Materials format. Letters include new research works that may impact the research in a specific field.

Language:

All manuscripts must be written in clear, concise English, and be consistent in style, spelling, and syntax. Manuscripts will be published in English. If the quality of the English of your manuscript does not satisfy the journal standards, the authors should bear the proofreading fee (JPY 10000 or equivalent in USD), which will be charged with the publication fee.

Title page:

The first page should be arranged in the following manner: title, name of authors, academic and professional affiliation of the authors as well as one address for correspondence.

Figures, tables, and captions:

Figures, Tables, and their captions should be organized in a file and submitted separately from the main text. When figures or tables are cited in the text, repeat their number for each lettered figure or table; e.g., Figs. 7(a) and 7(b). Each figure should be numbered in the Arabic font and have a short title written below it. Each table should be numbered in the Arabic font and have a short title written above it. After acceptance, please submit your original data in individual files, which should be labeled clearly (e.g., Fig1a, Fig1b) and organized in one folder, not pasted in a document file. This will contribute to prompt publication of your paper. Color figures will be published as they are in the electronic version but will be printed in black and white in the printed version. If the author prefers color figures in the printed version, the author shall have to bear the extra costs involved (JPY 20000 per color page). For further information regarding color printing, please contact us.

Equations:

Equations should be prepared using TeX. Send TeX source files separately from the main text. Please use the abbreviation "Eq." for equations; e.g., Eq. (1); Eqs. (2) and (3).

References:

References should be consecutively numbered in the text and should be listed by number. In the text, each reference should be denoted by the corresponding list number as a superscript in parentheses. Use the following examples: 1 for a journal, 2 for a book, and 3 for proceedings, and 4 for online data.
1 K. Umino, M. Habara, and K. Toko: Sens. Mater. 24 (2012) 1.
2 F. Li and A. Nathan: CCD Image Sensors in Deep-Ultraviolet: Degradation Behavior and Damage Mechanisms (Springer, Heidelberg, 2005) p. 71.
3 M. A. Matin, K. Ozaki, D. Akai, K. Sawada, and M. Ishida: Proceedings of 2012 IEEE 62nd Electronic Components and Technology Conference (IEEE, 2012) p. 356.
4 XYZ Institution: Homepage of XYZ Institution, http://xyz-institution.com (accessed April 2016).

For Endnote users

Output style for Sensors and Materials




Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on Advanced Sensing Technology for Smart Manufacturing
Guest editor, Chien-Hung Liu (National Chung Hsing University)


Special Issue on International Conference on BioSensors, BioElectronics, BioMedical Devices, BioMEMS/NEMS and Applications 2016 (Bio4Apps 2016)
Guest editor, Dzung Dao (Griffith University)
Call for paper


Special Issue on Retinal Prosthesis
Guest editor, Jun Ohta (Nara Institute of Science and Technology), Hiroyuki Tashiro (Kyusyu University), and Yasuo Terasawa (Nidek Co., Ltd.)
Call for paper


Special Issue on Innovative and Intelligent Sensing Analysis and Experiment for Functional Materials
Guest editor, Cheng-Chi Wang (National Chin-Yi University of Technology)
Conference website


Special Issue Dedicated to Professor Toshitsugu Ueda for His Achievements in Sensing Technologies
Guest editor, Satoshi Ikezawa (Waseda University) and Jinxing Liang (Southeast University)


Special Issue on ICASI2017
Guest editor, Teen-Hang Meen (National Formosa University), Shoou-Jinn Chang National Cheng Kung University), and Stephen D. Prior (University of Southampton)
Conference website
Call for paper


Special Issue on Open Collaboration for MEMS
Guest editor, Masayoshi Esashi (Tohoku University)


Special Issue on the International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017)
Guest editor, Wen-Hsiang Hsieh (National Formosa University)
Conference website


Special Issue on Internet of Things (IoT) and Applications for Improving Quality of Life
Guest editor, Hidetaka Nambo (Kanazawa University)
Call for paper


Special Issue on Materials, Devices, Circuits, Analytical Methods for Various Sensors (Selected Papers from ICSEVEN 2017)
Guest editor, Chien-Jung Huang (National University of Kaohsiung, Chi-Chih Liao (II-V Epiworks, Inc.), and Ja-Hao Chen (Feng Chia University)
Conference website
Call for paper


Special Issue on Sensors and Materials for Cyber-Physical Applications
Guest editor, Pitikhate Sooraksa (King Mongkut’s Institute of Technology Ladkrabang)
Call for paper


Special Issue on Biosensing Materials and Engineering for Electrobiology
Guest editor, Toshiya Sakata (The University of Tokyo)
Call for paper


Special Issue on Micro Energy Harvesting and Storing Technologies
Guest editor, Bin Yang (Shanghai Jiao Tong University)
Call for paper


Special Issue on Advances in Devices and Materials for Stress-Strain Sensing
Guest editor, Toshiyuki Toriyama and Taeko Ando (Ritsumeikan University)
Call for paper


Special Issue on Remote Sensing and Sensing Devices
Guest editor, Haruichi Kanaya (Kyushu University)
Call for paper


Special Issue on International Conference on BioSensors, BioElectronics, BioMedical Devices, BioMEMS/NEMS and Applications 2017 (Bio4Apps 2017)
Guest editor, Toshihiro Itoh (The University of Tokyo)
Conference website


Special Issue on Micro/Nano Sensing Platforms Exploring Biomedical Innovation
Guest editor, Ryoji Kurita (National Institute of Advanced Industrial Science and Technology)
Call for paper



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