Sensors and Materials

We will celebrate the 30th anniversary of Sensors and Materials in 2018.
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
To submit your manuscript, please use our Online Manuscript Submission System.

To subscribe to Sensors and Materials, please contact us.

Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Guidelines
English    日本語

Template
English

General Notes on Format
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3821-2930
 Fax: 81-3-3827-8547

Twitter

ISSN 0914-4935

Cover of latest issue




Proofreading Services
MYU Group
provides English proofreading, translation, and recording services for your submissions and presentations. The quality of the services is highly regarded by many researchers in Japan and other Asian countries.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials,
Volume 30, Number 4(1) (2018)

Copyright(C) MYU K.K. All Rights Reserved.
pp. 779-789
S&M1538
http://dx.doi.org/10.18494/SAM.2018.1843
Published: April 13, 2018

Translational Engineering: Best Practices in Developing MEMS for Volume Manufacturing [PDF]

Alissa M. Fitzgerald, Keith M. Jackson, Charles C. Chung, and Carolyn D. White

(Received December 8, 2017; Accepted February 26, 2018)

Keywords: MEMS, development, prototyping, foundry transfer, high-volume manufacturing, commercialization, translational engineering, production

New MEMS devices are usually invented by academics having a goal of advancing technology and knowledge in their field. Along the way, market opportunities are often found, and then a new goal arises, to commercialize the technology. However, the initial prototype was never engineered to meet this new goal. Before a new MEMS device can be commercialized, it must be reengineered and adapted for the volume manufacturing environment. In this paper, we describe our method of “translational engineering”, developed over the past 15 years, to translate proof-of-concept prototypes by academic inventors into robust, advanced prototypes that can be successfully transferred to production.

Corresponding author: Alissa M. Fitzgerald


Cite this article
Alissa M. Fitzgerald, Keith M. Jackson, Charles C. Chung, and Carolyn D. White, Translational Engineering: Best Practices in Developing MEMS for Volume Manufacturing, Sens. Mater., Vol. 30, No. 4, 2018, p. 779-789.


Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue Dedicated to Professor Toshitsugu Ueda for His Achievements in Sensing Technologies
Guest editor, Satoshi Ikezawa (Waseda University) and Jinxing Liang (Southeast University)


Special Issue on Micro Energy Harvesting and Storing Technologies
Guest editor, Bin Yang (Shanghai Jiao Tong University); Submission deadline, extended to March 20, 2018
Call for paper


Special Issue on Internet of Things (IoT) and Applications for Improving Quality of Life
Guest editor, Hidetaka Nambo (Kanazawa University)
Call for paper


Special Issue on the International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017) (1)
Guest editor, Wen-Hsiang Hsieh (National Formosa University)
Conference website


Special Issue on the International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017) (2)
Guest editor, Wen-Hsiang Hsieh (National Formosa University)
Conference website


4th Special Issue on the Workshop of Next-Generation Front-Edge Optical Science Research
Guest editor, Hidehito Nanto (Kanazawa Institute of Technology)


Special Issue on Sensors and Materials for Cyber-Physical Applications
Guest editor, Pitikhate Sooraksa (King Mongkut’s Institute of Technology Ladkrabang)
Call for paper


Special Issue on Innovative and Intelligent Sensing Analysis and Experiment for Functional Materials
Guest editor, Cheng-Chi Wang (National Chin-Yi University of Technology)
Conference website


Special Issue on Biosensing Materials and Engineering for Electrobiology
Guest editor, Toshiya Sakata (The University of Tokyo)
Call for paper


Special Issue on Advances in Devices and Materials for Stress-Strain Sensing
Guest editor, Toshiyuki Toriyama and Taeko Ando (Ritsumeikan University)
Call for paper


Special Issue on Remote Sensing and Sensing Devices
Guest editor, Haruichi Kanaya (Kyushu University)
Call for paper


Special Issue on International Conference on BioSensors, BioElectronics, BioMedical Devices, BioMEMS/NEMS and Applications 2017 (Bio4Apps 2017)
Guest editor, Toshihiro Itoh (The University of Tokyo); Submission deadline, May 15, 2018
Conference website
Call for paper


Special Issue on Nanostructure and Its Application in Sensors
Guest editor, Tie Li (Shanghai Institute of Microsystem and Information Technology)
Call for paper


Special Issue on Micro/Nano Sensing Platforms Exploring Biomedical Innovation
Guest editor, Ryoji Kurita (National Institute of Advanced Industrial Science and Technology)
Call for paper


Special Issue on Mechanical and Thermal Reliability of Micro/Nanomaterials
Guest editor, Takahiro Namazu (Aichi Institute of Technology) and Shugo Miyake (Kobe City College of Technology)
Call for paper


Special Issue on Universal Power Supply Technologies for Trillion Sensors Era
Guest editor, Keiji Takeuchi (NTT Data Institute of Management Consulting, Inc.)
Call for paper


Special Issue on the Workshop on Sensors and Applications for Fishery and Agricultural Industries
Guest editor, Masaaki Wada (Future University Hakodate) and Katsumori Hatanaka (Tokyo University of Agriculture); Submission deadline, October 12, 2018
Call for paper


Special Issue on Selected Papers from ICASI2018
Guest editor, Teen-Hang Meen (National Formosa University), Shoou-Jinn Chang National Cheng Kung University), and Stephen D. Prior (University of Southampton)
Conference website
Call for paper


Special Issue on the International Multi-Conference on Engineering and Technology Innovation 2018 (IMETI2018)
Guest editor, Wen-Hsiang Hsieh (National Formosa University)
Conference website


Special Issue on Materials, Devices, Circuits, Analytical Methods for Various Sensors (Selected Papers from ICSEVEN 2018)
Guest editor, Chien-Jung Huang (National University of Kaohsiung), Chi-Chih Liao (II-V Epiworks, Inc.), and Ja-Hao Chen (Feng Chia University)
Conference website
Call for paper


Special Issue on Carbon Material-based Chemical and Biochemical Sensors
Guest editor, Yuko Ueno (NTT Basic Research Laboratories) and Osamu Niwa (Saitama Institute of Technology)
Call for paper



Copyright(C) MYU K.K. All Rights Reserved.