ISSN 0914-4935

Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
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Sensors and Materials,
Volume 30, Number 4(1) (2018)

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pp. 723-731
Published: April 13, 2018

Trillion Sensors and MEMS [PDF]

Susumu Kaminaga

(Received November 23, 2017; Accepted January 29, 2018)

Keywords: Trillion Sensors (TSensors), micro-electromechanical systems (MEMS), Internet of things (IoT), deep reactive ion etching (DRIE), Bosch process, advanced silicon etch (ASE)

The Trillion Sensors (TSensors) Initiative was started in 2013 in the US alongside the global economic tide of the Internet of things (IoT) to pursue a society in which trillion sensors are connected to networks worldwide so that global problems may be solved in order to attain a utopian world, Abundance. It will provide all the people with food, medicine and healthcare, a clean environment, disaster resilience, and clean energy. TSensors as a subset of the IoT that is becoming widely prevalent in recent years has been enabled by micro-electromechanical systems (MEMS) which have undergone dramatic growth in the last few decades and have been playing an essential role in the emerging world of IoT. One of the most essential technologies that has made possible the remarkable growth of MEMS is the deep reactive ion etching (DRIE) based on the Bosch process patented by Robert Bosch more than 20 years ago. The technology has been continuously developed to enhance its capability for over 20 years under the author’s lead, in order to broaden the range of application of MEMS in automotives, gaming, smartphones, and sensor networks in the world of IoT.

Corresponding author: Susumu Kaminaga

Cite this article
Susumu Kaminaga, Trillion Sensors and MEMS, Sens. Mater., Vol. 30, No. 4, 2018, p. 723-731.

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