Sensors and Materials
ISSN 0914-4935

Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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Sensors and Materials,
Volume 29, Number 12 (2017)

Copyright(C) MYU K.K. All Rights Reserved.
pp. 1733-1747
S&M1466
https://doi.org/10.18494/SAM.2017.1727
Published: December 22, 2017

Piezoelectric Thick Film Based on Bonding technologies for Energy Harvester [PDF]

Gang Tang, Bufeng Bao, Zhiran Yi, Guimiao Li, Bin Yang, and Jingquan Liu

(Received August 21, 2017; Accepted November 19, 2017)

Keywords: piezoelectric thick film, bonding technologies, piezoelectric energy harvesters

With the development of low-power-consumption electronic devices and systems, the development of power supplies will be a major challenge. High-performance piezoelectric energy harvesters (PEHs) are an alternative that convert mechanical deformation into electric charge. For PEHs, it is highly desirable to utilize materials with a high piezoelectric charge coefficient. Piezoelectric thick films based on bonding and thinning technologies meet this requirement due to their high-temperature sintering process. In this paper we review the development of piezoelectric thick film fabrication processes, including the direct bonding process and the transferring process. Additionally, PEHs in substrates for different applications are described. Moreover, we summarize and compare the output performance of thick-film-based PEHs from all recently published papers in terms of normalized power density and resonant frequency.

Corresponding author: Bin Yang


Cite this article
Gang Tang, Bufeng Bao, Zhiran Yi, Guimiao Li, Bin Yang, and Jingquan Liu, Piezoelectric Thick Film Based on Bonding technologies for Energy Harvester, Sens. Mater., Vol. 29, No. 12, 2017, p. 1733-1747.


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