Sensors and Materials

We will celebrate the 30th anniversary of Sensors and Materials in 2018.
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
To submit your manuscript, please use our Online Manuscript Submission System.

To subscribe to Sensors and Materials, please contact us.

Sensors and Materials
is covered by Science Citation Index Expanded (Thomson Reuters), Scopus (Elsevier), and other databases.

Guidelines
English    Japanese

Templates
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3821-2930
 Fax: 81-3-3827-8547

Twitter

ISSN 0914-4935

Cover of latest issue




Proofreading Services
MYU Group
provides English proofreading, translation, and recording services for your submissions and presentations. The quality of the services is highly regarded by many researchers in Japan and other Asian countries.


Myu Research

(proofreading and recording)
(Japanese Only)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials,
Volume 29, Number 6(2) (2017)

Copyright(C) MYU K.K. All Rights Reserved.
pp. 843-854
S&M1373
http://dx.doi.org/10.18494/SAM.2017.1573
Online Published: June 21, 2017

Biocompatibility Tests and Adhesion Improvements for Hydrogen-Free Amorphous Carbon for Blood-Contacting Medical Devices

Yuya Yamato, Shunto Maegawa, Terumitsu Hasebe, Kenta Bito, Tomohiro Matsumoto, Takahiko Mine, Toshihiko Hayashi, Asushi Hotta, and Tetsuya Suzuki

(Received January 12, 2016; Accepted May 9, 2017)

Keywords: amorphous carbon, biomaterial, adhesive properties, biocompatibility

The hydrogenated amorphous carbon (a-C:H) film has been known as a coating material that imparts improved biocompatibility to base materials and has been used for many clinical applications. Recent studies have revealed that hydrogen-free amorphous carbon (H-free a-C) on stainless steel (SUS) has beneficial antibacterial properties, which allow avoidance of the risk of bacterial infection. In our study, to evaluate the biocompatibility of H-free a-C itself for blood-contacting devices, we investigated not only the ability to grow bacteria but also platelet aggregation on the surfaces of H-free a-C. Moreover, to apply H-free a-C to polytetrafluoroethylene (PTFE), we evaluated the adhesive properties of H-free a-C deposited after Ar or O2 plasma pre-treatment and fluorine-incorporated a-C:H (a-C:H:F) interlayer deposition. Antibacterial tests and antithrombogenic tests indicated that H-free a-C coating reduced bacterial adhesion and platelet activation in comparison with a-C:H coating. The adhesive strength of plasma-treated Ar and the interlayer deposited PTFE was five times larger than those of untreated PTFE from film adhesion tests. These results indicated that the pre-treated PTFE coated with H-free a-C is a promising candidate biomaterial for medical devices.

Corresponding author: Terumitsu Hasebe

[PDF]


Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on Advanced Sensing Technology for Smart Manufacturing
Guest editor, Chien-Hung Liu (National Chung Hsing University)


Special Issue on International Conference on BioSensors, BioElectronics, BioMedical Devices, BioMEMS/NEMS and Applications 2016 (Bio4Apps 2016)
Guest editor, Dzung Dao (Griffith University)
Call for paper


Special Issue on Retinal Prosthesis
Guest editor, Jun Ohta (Nara Institute of Science and Technology), Hiroyuki Tashiro (Kyusyu University), and Yasuo Terasawa (Nidek Co., Ltd.)
Call for paper


Special Issue on Innovative and Intelligent Sensing Analysis and Experiment for Functional Materials
Guest editor, Cheng-Chi Wang (National Chin-Yi University of Technology)
Conference website


Special Issue Dedicated to Professor Toshitsugu Ueda for His Achievements in Sensing Technologies
Guest editor, Satoshi Ikezawa (Waseda University) and Jinxing Liang (Southeast University)


Special Issue on ICASI2017
Guest editor, Teen-Hang Meen (National Formosa University), Shoou-Jinn Chang National Cheng Kung University), and Stephen D. Prior (University of Southampton)
Conference website
Call for paper


Special Issue on Open Collaboration for MEMS
Guest editor, Masayoshi Esashi (Tohoku University)


Special Issue on the International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017)
Guest editor, Wen-Hsiang Hsieh (National Formosa University)
Conference website


Special Issue on Internet of Things (IoT) and Applications for Improving Quality of Life
Guest editor, Hidetaka Nambo (Kanazawa University)
Call for paper


Special Issue on Materials, Devices, Circuits, Analytical Methods for Various Sensors (Selected Papers from ICSEVEN 2017)
Guest editor, Chien-Jung Huang (National University of Kaohsiung, Chi-Chih Liao (II-V Epiworks, Inc.), and Ja-Hao Chen (Feng Chia University)
Conference website
Call for paper


Special Issue on Sensors and Materials for Cyber-Physical Applications
Guest editor, Pitikhate Sooraksa (King Mongkut’s Institute of Technology Ladkrabang)
Call for paper


Special Issue on Biosensing Materials and Engineering for Electrobiology
Guest editor, Toshiya Sakata (The University of Tokyo)
Call for paper


Special Issue on Micro Energy Harvesting and Storing Technologies
Guest editor, Bin Yang (Shanghai Jiao Tong University)
Call for paper


Special Issue on Advances in Devices and Materials for Stress-Strain Sensing
Guest editor, Toshiyuki Toriyama and Taeko Ando (Ritsumeikan University)
Call for paper


Special Issue on Remote Sensing and Sensing Devices
Guest editor, Haruichi Kanaya (Kyushu University)
Call for paper


Special Issue on International Conference on BioSensors, BioElectronics, BioMedical Devices, BioMEMS/NEMS and Applications 2017 (Bio4Apps 2017)
Guest editor, Toshihiro Itoh (The University of Tokyo)
Conference website


Special Issue on Micro/Nano Sensing Platforms Exploring Biomedical Innovation
Guest editor, Ryoji Kurita (National Institute of Advanced Industrial Science and Technology)
Call for paper



Copyright(C) MYU K.K. All Rights Reserved.