Sensors and Materials

We will celebrate the 30th anniversary of Sensors and Materials in 2018.
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
To submit your manuscript, please use our Online Manuscript Submission System.

To subscribe to Sensors and Materials, please contact us.

Sensors and Materials
is covered by Science Citation Index Expanded (Thomson Reuters), Scopus (Elsevier), and other databases.

Guidelines
English    Japanese

Templates
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3821-2930
 Fax: 81-3-3827-8547

Twitter

ISSN 0914-4935

Cover of latest issue




Proofreading Services
MYU Group
provides English proofreading, translation, and recording services for your submissions and presentations. The quality of the services is highly regarded by many researchers in Japan and other Asian countries.


Myu Research

(proofreading and recording)
(Japanese Only)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials,
Volume 29, Number 8 (2017)

Copyright(C) MYU K.K. All Rights Reserved.
pp. 1181-1190
S&M1410
http://dx.doi.org/10.18494/SAM.2017.1539
Online Published: August 16, 2017

Space Charge Measurement for a 27-mm Thick Cross-Linked Polyethylene Sample using the PEA Method

Masumi Fukuma and Takashi Maeno

(Received December 5, 2016; Accepted April 24, 2017)

Keywords: space charge, thick sample, XLPE, polymer insulating material, PEA method

Cross-linked polyethylene (XLPE) is used in electric power cables as insulation. The maximum thickness of an XLPE layer is 27 mm in a 500 kV class electric power cable. The pulsed electroacoustic (PEA) method is widely used to measure the space charge distribution in dielectric materials. When measuring the space charge distribution in dielectric materials using the normal PEA method, the acoustic wave (PEA signal) from which the space charge profile is obtained is detected by a piezoelectric device in the system. Usually, the sample thickness is less than 10 mm in a normal PEA system. When a thicker sample is used, the space charge measurement is very difficult to obtain with a normal PEA system, because the amplitude of the acoustic wave from the upper electrode decreases with thickness compared with that of the acoustic wave from the lower electrode. Using a redesigned PEA system, space charge distributions have been measured in the 27-mm-thick XLPE sample in a 1 kV/mm DC electric field. The experimental results show that the redesigned PEA system can detect a PEA signal from the lower and upper electrodes in the 27-mm-thick XLPE sample. The deconvolution technique applied to the dispersion in the thick XLPE sample has also been improved.

Corresponding author: Masumi Fukuma

[PDF]


Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on Advanced Sensing Technology for Smart Manufacturing
Guest editor, Chien-Hung Liu (National Chung Hsing University)


Special Issue on International Conference on BioSensors, BioElectronics, BioMedical Devices, BioMEMS/NEMS and Applications 2016 (Bio4Apps 2016)
Guest editor, Dzung Dao (Griffith University)
Call for paper


Special Issue on Retinal Prosthesis
Guest editor, Jun Ohta (Nara Institute of Science and Technology), Hiroyuki Tashiro (Kyusyu University), and Yasuo Terasawa (Nidek Co., Ltd.)
Call for paper


Special Issue on Innovative and Intelligent Sensing Analysis and Experiment for Functional Materials
Guest editor, Cheng-Chi Wang (National Chin-Yi University of Technology)
Conference website


Special Issue Dedicated to Professor Toshitsugu Ueda for His Achievements in Sensing Technologies
Guest editor, Satoshi Ikezawa (Waseda University) and Jinxing Liang (Southeast University)


Special Issue on ICASI2017
Guest editor, Teen-Hang Meen (National Formosa University), Shoou-Jinn Chang National Cheng Kung University), and Stephen D. Prior (University of Southampton)
Conference website
Call for paper


Special Issue on Open Collaboration for MEMS
Guest editor, Masayoshi Esashi (Tohoku University)


Special Issue on the International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017)
Guest editor, Wen-Hsiang Hsieh (National Formosa University)
Conference website


Special Issue on Internet of Things (IoT) and Applications for Improving Quality of Life
Guest editor, Hidetaka Nambo (Kanazawa University)
Call for paper


Special Issue on Materials, Devices, Circuits, Analytical Methods for Various Sensors (Selected Papers from ICSEVEN 2017)
Guest editor, Chien-Jung Huang (National University of Kaohsiung, Chi-Chih Liao (II-V Epiworks, Inc.), and Ja-Hao Chen (Feng Chia University)
Conference website
Call for paper


Special Issue on Sensors and Materials for Cyber-Physical Applications
Guest editor, Pitikhate Sooraksa (King Mongkut’s Institute of Technology Ladkrabang)
Call for paper


Special Issue on Biosensing Materials and Engineering for Electrobiology
Guest editor, Toshiya Sakata (The University of Tokyo)
Call for paper


Special Issue on Micro Energy Harvesting and Storing Technologies
Guest editor, Bin Yang (Shanghai Jiao Tong University)
Call for paper


Special Issue on Advances in Devices and Materials for Stress-Strain Sensing
Guest editor, Toshiyuki Toriyama and Taeko Ando (Ritsumeikan University)
Call for paper


Special Issue on Remote Sensing and Sensing Devices
Guest editor, Haruichi Kanaya (Kyushu University)
Call for paper


Special Issue on International Conference on BioSensors, BioElectronics, BioMedical Devices, BioMEMS/NEMS and Applications 2017 (Bio4Apps 2017)
Guest editor, Toshihiro Itoh (The University of Tokyo)
Conference website


Special Issue on Micro/Nano Sensing Platforms Exploring Biomedical Innovation
Guest editor, Ryoji Kurita (National Institute of Advanced Industrial Science and Technology)
Call for paper



Copyright(C) MYU K.K. All Rights Reserved.